Manufacturing method of raised circuit structure of flexible board, and raised circuit structure of flexible board

Abstract

The invention discloses a manufacturing method for a raised circuit structure of a flexible board. The method comprises the steps: windowing a position, where the raised circuit structure is to be manufactured, of a first covering film to form a first windowing region, stampingthe position of the first windowing region from the second surface to the first surface of the flexible board, forming a concave position in the second surface, forming a convex bonding pad on the first surface, manufacturing a protective layer on the first surface, pasting a dry film on the second surface, forming a dryfilm layer, windowing the position, corresponding to the concave position, of the dry film layer to form a second windowing region, filling a filler into the concave position through the second windowing region, removing the dry film layer, removing redundant filler, attaching a second covering film to the second surface, removing a protective layer, and thus, obtaining the raised circuit structure of the flexible board. The manufacturing process is simple, the manufacturing cost is low, and the reliability of the raised circuit structure of the flexible board is effectively improved.

Description

technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a method for manufacturing a raised circuit structure of a flexible board and the raised circuit structure of a flexible board. Background technique [0002] Some chip components need to use crimping circuit mode. For example, the circuit board corresponding to the insertion position of the IC chip of the bank card, the pad needs to be made into a raised circuit structure, so as to accurately combine the insertion position of the IC chip. [0003] At present, it is generally produced by two (or multiple) cumulative electroplating methods, that is, by pasting dry film, multiple electroplating, and multiple micro-etching on the position where the raised circuit structure is to be made, a cumulative copper layer structure is formed. Thus, a raised line structure is formed. [0004] This kind of production method mainly has the following problems: [0005] 1. The producti...

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Problems solved by technology

[0005] 1. The production process is complicated: the technological process of multiple dry film application, multiple electroplating, and multiple micro-etching is relatively complicated, and there are many hidden dangers of defects in complex technological processes;

[0006] 2. Insufficient product reliability: Since the bonding force between the copper layer and the copper layer of each electroplating has a certain limit, the raised circuit structure formed by the cumulative electroplating method is easy to be bonded to the covered film layer in subsequent processing. Hiding the potion will cause problems such as loosening and falling off of the covering film, or in the later application, repeated friction for a long time will easily cause problems such as loosening between the raised circuit structure and the copper layer of the board body, and pad falling off;

[0007] 3. High production cost: dry film application, electroplating, and micro-etching are all relatively expensive processes in the circuit board production process, and multiple processing will undoubtedly double the cost;

[0008] 4. It is not conducive to subsequent processing: the raised pad made by electroplating causes the circuit surface to be uneven, which brings certain difficulties to the subsequent processing of other processes

[0009] For the above problems, no effective solutions have been proposed so far

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