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Circuit board manufacturing method

A manufacturing method and circuit board technology, which is applied in printed circuit manufacturing, multi-layer circuit manufacturing, printed circuit, etc., can solve the problems of easy cracking at the glue filling, glue overflow on the surface of aluminum nitride, poor flatness, etc. , to achieve the effect of improving glue overflow, avoiding cracking and improving flatness

Active Publication Date: 2022-02-22
KINWONG ELECTRONICS TECH LONGCHUAN
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Problems solved by technology

[0007] The purpose of the embodiments of the present invention is to provide a circuit board manufacturing method to solve the problems in the prior art that the surface of the aluminum nitride and the surface of the substrate are poorly even, and the glue filling between the aluminum nitride and the substrate is easy to solve. Technical problems of cracking and glue overflow on the surface of aluminum nitride

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Embodiment Construction

[0042] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0043] In describing the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientation or positional relationship indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than Nothing indicating or implying that a referenced device or element must have a particular orientation,...

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Abstract

The present invention relates to the technical field of circuit board manufacturing, and provides a circuit board manufacturing method, including the steps of material preparation, initial positioning preparation, heat conduction embedding, fine positioning preparation, press-fit connection and tearing film forming. In the initial positioning preparation step, Attach the initial positioning protective film on the lower base of the Mth core board; in the heat conduction embedding step, embed the heat conduction block into the heat conduction accommodation groove, and adhere the lower surface of the heat conduction block to the initial positioning protective film to make the heat conduction The lower surface of the block is flush with the lower base surface of the M core board; in the fine positioning preparation step, a fine positioning protective film is attached to the upper base surface of the first core board and the upper surface of the heat conduction block, and the heat conduction block The upper surface of the first core plate is flush with the upper base surface of the first core board. By adopting this method, the risk of open circuit phenomenon in the circuit made on the upper surface and the lower surface of the interconnection substrate can be reduced; the risk of cracking phenomenon in the glue filling between the heat conduction block and the substrate can be reduced; the interconnection substrate can be improved. Glue overflow on the upper and lower surfaces.

Description

technical field [0001] The invention belongs to the technical field of circuit board manufacturing, and in particular relates to a method for manufacturing a circuit board. Background technique [0002] In related industries, aluminum nitride with high thermal conductivity and thermal shock resistance will be embedded on the circuit board to meet the high heat dissipation requirements of the circuit board. In the traditional process, aluminum nitride is first embedded in the substrate, then pressed, and then the circuit is made on the surface of the substrate and aluminum nitride. However, it inevitably has the following problems: [0003] 1) The flatness between the surface of aluminum nitride and the surface of the substrate is poor, so that the formed circuit is prone to open circuit phenomenon; [0004] 2) The glue filling between aluminum nitride and the substrate is uneven, and cracking is easy to occur; [0005] 3) The surface of aluminum nitride is prone to glue ov...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K3/28H05K1/02
CPCH05K3/4697H05K1/0204H05K3/281H05K3/4682H05K2201/10416H05K2203/1377
Inventor 王俊叶志峰沙伟强谢光前
Owner KINWONG ELECTRONICS TECH LONGCHUAN
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