Method for tearing off release films at multiple positions at time

Abstract

Provided is a method for tearing off release films at multiple positions at a time. Only one independent pull handle is needed, a glue area and a bottom layer heat conduction film can be separated from two faces of each release film. The die cutting process is simple, and the production efficiency of a production line is improved. The method comprises a bottom layer heat conduction film, a middlelayer release film and an upper layer adhesive area layer arranged from bottom to top in the thickness direction, the middle layer release film comprises a release surface on the lower surface and a silica gel surface on the upper surface, the middle layer release film covers the surface area of the bottom layer heat conduction film, and a laterally-protruding pull handle structure is arranged onone side of the periphery of the middle layer release film. The upper surface of the corresponding area of the middle release film is covered with the upper adhesive area layer according to the actualarea, the peripheral area, corresponding to the handle structure, of the middle release film is larger than the corresponding area of the upper adhesive area layer, and the viscosity of the silica gel face of the middle release film is 3-6 g / in.

Description

technical field [0001] The invention relates to the technical field of film layer separation, in particular to a method for tearing off multiple release films at one time. Background technique [0002] In the existing die-cutting technology field, a release film is provided between the glue area and the bottom heat-conducting film. In the actual processing process, after the glue area is formed, in order to facilitate separation from the lower release film, it is necessary to set the actual area of ​​the glue area Expand the periphery of the rubber area to set up an independent handle structure to facilitate the separation of the glue area and the release film. The handle structure of the glue area needs to be punched independently, which increases the process flow, and the release film itself needs to be set in the corresponding position and The independent handle structure of the bottom heat-conducting film, which makes the separation of the three-layer film, needs to be p...

AI Technical Summary

Problems solved by technology

[0002] In the existing die-cutting technology field, a release film is provided between the glue area and the bottom heat-conducting film. In the actual processing process, after the glue area is formed, in order to facilitate separation from the lower release film, it is necessary to set the actual area of ​​the glue area Expand the periphery of the rubber area to set up an independent handle structure to facilitate the separation of the glue area and the release film. The handle structure of the glue area needs to be punched independently, which increases the process flow, and the release film itself needs to be set in the corresponding position and The independent handle structure of the bottom heat-conducting film, which makes the separation of the three-layer film, requires two independent handles, and requires the operator to perform two tear-off tasks, making the entire production process relatively complicated

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