Time-frequency combined rapid full-focusing ultrasonic imaging method

An ultrasonic imaging method and an all-focus image technology, which can be used in the analysis of solids using sound waves/ultrasonic waves/infrasonic waves, material analysis using sound waves/ultrasonic waves/infrasonic waves, and processing detection response signals. It can solve problems such as insufficient improvement in computing efficiency , to achieve good application prospects, fast imaging speed, and high-precision quantitative effects

Active Publication Date: 2020-12-11
NANCHANG HANGKONG UNIVERSITY
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Problems solved by technology

However, this method of reducing the amount of data still fails to avoid iterative operations pixel by pixel, and can only shorten the operation time by a fraction, and the increase in operation efficiency is not obvious enough.

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  • Time-frequency combined rapid full-focusing ultrasonic imaging method
  • Time-frequency combined rapid full-focusing ultrasonic imaging method
  • Time-frequency combined rapid full-focusing ultrasonic imaging method

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Embodiment Construction

[0022] The present invention will be further described below in conjunction with drawings and embodiments. see Figure 1 to Figure 4 , a fast all-focus imaging technology combined with time-frequency, taking a 32-element phased array probe to detect a 30mm-depth Φ2 side drill hole in a 60mm-thick aluminum test block as an example, and the operation steps are as follows:

[0023] 1) if figure 1 As shown, a full-matrix ultrasonic signal acquisition system is built through a phased array probe 1, a multi-channel selector 2, an ultrasonic signal transmitter receiver 3, a digital oscilloscope 4, and a computer terminal 5. Among them, the phased array probe 1 is connected with the multi-channel selector 2, and the multi-channel selector 2 and the ultrasonic signal transmitter receiver 3 are connected through the transmitting interface TX and the receiving interface RX, and the connection between the multi-channel selector 2 and the computer terminal 5 They are connected through a ...

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Abstract

The invention discloses a time-frequency combined rapid full-focusing ultrasonic imaging method, which comprises the following steps of firstly, splitting acquired three-dimensional full-matrix data into N two-dimensional matrix slices, secondly, by means of two-dimensional forward/inverse Fourier transform, achieving received wave field extrapolation on each depth layer on a certain slice step bystep, then, by calculating a delay matrix from each pixel point to a transmitting array element, interpolating the extrapolated time domain signal to realize focusing on the slice, and finally, repeating the phase shift and interpolation operation on the N two-dimensional slices and accumulating to obtain a time-frequency combined full-focus image. The method has the advantages that compared withtraditional time domain full focusing, the method is low in complexity and high in imaging speed, the problem that full focusing is difficult to achieve real-time imaging is expected to be solved, high-precision quantification, positioning and qualitative determination of internal defects of materials can be effectively achieved, and the method has good application and popularization prospects.

Description

technical field [0001] The invention relates to the field of ultrasonic nondestructive testing, in particular to a time-frequency combined fast all-focus ultrasonic imaging method. Background technique [0002] Total focusing method (TFM) is a phased array ultrasound post-processing imaging technology that has emerged in recent years. Compared with the traditional phased array imaging technology, this technology is an off-line imaging technology that relies on full matrix capture (FMC), which overcomes the shortcomings of the limited number of emitted acoustic beams in the traditional technology, and through off-line processing Achieve focus on the entire inspected area. Research shows that compared with B-type, C-type, D-type, and S-type views provided by traditional phased arrays, TFM images have higher detection signal-to-noise ratio and resolution, and their defect detection capabilities and quantitative accuracy are higher. For this reason, relevant scholars call omni...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N29/06G01N29/44
CPCG01N29/0654G01N29/449G01N2291/023G01N2291/0289G01N2291/106
Inventor 陈尧冒秋琴卢超杨振轩章卓才
Owner NANCHANG HANGKONG UNIVERSITY
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