Aluminum profile substrate for refrigerant heat dissipation
A refrigerant heat dissipation, aluminum profile technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve the problems of high heat dissipation efficiency, low cost, small size, etc., to achieve efficient heat dissipation and improve heat dissipation The effect of efficiency and stability
Pending Publication Date: 2020-12-15
LINYI UNIVERSITY +1
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Problems solved by technology
[0005] Aiming at the problems existing in the heat dissipation of high-power electronic components at present, the present invention proposes an aluminum profile substrate for heat dissipation of the refrigerant, that is, the micro-channel aluminum alloy profile is used to make the refrigerant flow in parallel in multiple channels. Compared with the existing single-channel flow, It has the remarkable characteristics of low cost, small size and high heat dissipation efficiency, which can effectively solve the heat dissipation problem of high-power electronic components
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[0021] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0022] Such as figure 1 and figure 2 As shown, an aluminum profile substrate for heat dissipation of refrigerant includes an aluminum profile substrate 1, which is obtained by extruding and machining 6XXX aluminum, and has a plurality of parallel micro-channels inside; the hole of the aluminum profile substrate 1 The boss 2 for placing high-power electronic components and the threaded hole for fixing are processed on the processing surface 5; the substrate welding area 3 of the aluminum profile substrate 1 is connected with the substrate joint welding area 6 of the substrate joint 8; The refrigerant joint 7 is connected, and the refrigerant joint 7 is connected with the external refrigerant channel.
[0023] The substrate joint 8 is a hollow pipe with a rectangular hole processed on the side, made of composite material, and its surface is covered wit...
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The The invention discloses an aluminum profile substrate for refrigerant heat dissipation. The aluminum profile substrate comprises an aluminum profile substrate body, wherein the aluminum profile substrate body is obtained by extrusion forming and machining of a 6XXX aluminum bar, a plurality of parallel micro-channels are arranged in the aluminum profile substrate body, the aluminum profile base plate and the base plate connector are connected in a brazing mode, the substrate connector is connected with the refrigerant connector, and the refrigerant connector is connected with an external refrigerant channel. During use, through the flowing sequence of external high-pressure R410a / R134a and other refrigerants through the left side refrigerant connector, the left side substrate connector, the aluminum profile substrate, the right side substrate connector and the right side refrigerant connector, heat generated by high-power electronic components arranged on the aluminum profile substrate can be rapidly taken away, and efficient heat dissipation of the electronic components is achieved.
Description
technical field [0001] The invention relates to an aluminum profile substrate, in particular to an aluminum profile substrate for refrigerant heat dissipation. Background technique [0002] With the development of air conditioners, signal base stations, metallurgy, chemical industry, electric power and new energy vehicles, the market demand for high-power electronic components is increasing year by year, and their application prospects are very broad. However, the market share of high-end high-power electronic components in my country is insufficient, and most of them rely on foreign imports. The most important problem restricting the development of domestic high-power electronic components is insufficient stability. Under the current state of technology, how to improve the stability of high-power electronic components is the most effective way to break the dependence on imports of high-end electronic components. Studies have shown that the main failure modes of high-power ...
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IPC IPC(8): H05K7/20
CPCH05K7/20272
Inventor 李帅赵中华
Owner LINYI UNIVERSITY