A kind of pre-embedded full plug hole method of printed circuit board

Abstract

The invention discloses a method for pre-embedded full plug holes of printed circuit boards, which belongs to the technical field of circuit board manufacturing. Filling, and in the process of heating and curing, use heat to trigger the plugging action of the plugging rod, restore the freedom of the defoaming ball based on the phase change characteristics of the phase change rod, and perform high-frequency vibration under the action of elasticity to promote the extension to Vibration of the defoaming wire in the plugging material can effectively eliminate the air bubbles in the plugging material and accelerate the escape of the air in the plugging material to the outside. Under the cooperation of magnetic attraction, the defoaming rod is extruded, and the air in the defoaming rod is squeezed into the sealing ball to start to expand, and the openings at both ends of the through hole are blocked to avoid the entry of tin beads, which is different from the traditional Compared with the plug hole method, the invention can significantly improve the plug hole quality, and improve the problems of foaming and tin balls.

Description

Technical field [0001] The present invention relates to the field of circuit board manufacturing techniques, and more particularly to a pre-buried full plunger method of a printed circuit board. Background technique [0002] With the rapid development of electronic communication technology and electronic products, the board design is getting thinner, and the circuit board manufacturing plate thickness is 0.40mm, or even lower. In the development of the current board, the sheets have gradually become the trend of circuit board development, and the thin plate process has become a constraints of traditional circuit board technology. The main feature of the thin plate board is thin, and the general medium thickness is controlled in 60 um to 70um. Some thin plate manufacturers can make 55um or less, which gives a large challenge to the production of traditional circuit boards, especially press And plug holes and other processes. The thickness of the substrate in the sheet is 0.05 mm, ...

AI Technical Summary

Problems solved by technology

[0004] Most of the traditional circuit board buried hole or through hole plugging methods use the direct printing method of the plug hole material, which is often prone to blistering or tin bead problems, which seriously affects the quality of the circuit board plug hole

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