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Burr treatment device for preformed soldering lugs

A preform and processing device technology, which is applied in the direction of grinding drive devices, grinding machine parts, surface polishing machine tools, etc., can solve the problem of lack of deburring processing devices, etc., and achieve low labor intensity and high processing efficiency , High grinding efficiency

Inactive Publication Date: 2020-12-25
SHENZHEN XINGHONGTAI TIN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the production of solder preforms, because most of the solder chips are punched, it is necessary to deburr the solder chips. The burrs are mainly concentrated at the edges of the solder chips. manual polishing

Method used

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  • Burr treatment device for preformed soldering lugs
  • Burr treatment device for preformed soldering lugs
  • Burr treatment device for preformed soldering lugs

Examples

Experimental program
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Embodiment

[0025] A deburring device for solder preforms, comprising a bottom plate 1, a support column 2, a support platform 3, a support rod 4, a support plate 5, a gap 6, a first cylinder 7, a sand barrel 8, a support frame 9 and a second cylinder 10. The upper end of the base plate 1 is fixedly connected with a support column 2, the upper end of the support column 2 is fixedly connected with a support platform 3, the upper end of the support platform 3 is fixedly connected with a support rod 4, and the upper end of the support rod 4 A support plate 5 is fixedly connected, the middle part of the support plate 5 is provided with a gap 6, the upper end of the support plate 5 is fixedly connected with a first cylinder 7, and the inside of the support table 3 is fixedly connected with a sand cylinder 8. The outer side of sandbox 8 is fixedly connected with support frame 9, and the upper end of described support frame 9 is fixedly installed with motor 91, and the end of the motor shaft 92 o...

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Abstract

The invention discloses a burr treatment device for preformed soldering lugs. The burr treatment device comprises a bottom plate, a supporting column, a supporting table, a supporting rod, a supporting plate, a notch, a first air cylinder, a sand cylinder, a supporting frame and a second air cylinder, wherein the supporting column is fixedly connected to the upper end of the bottom plate, the supporting table is fixedly connected to the upper end of the supporting column, the supporting rod is fixedly connected to the upper end of the supporting table, the supporting plate is fixedly connectedto the upper end of the supporting rod, the notch is formed in the middle of the supporting plate, the first air cylinder is fixedly connected to the upper end of the supporting plate, the sand cylinder is fixedly connected to the interior of the supporting table, and the supporting frame is fixedly connected to the outer side of the sand cylinder. The burr treatment device has the characteristics of being high in polishing efficiency and convenient to operate, and in the specific use process, the soldering lugs are pre-assembled through a designed adjustable clamping sleeve, then the stackedsoldering lugs are tightly pressed through a cylinder cover driven by the first air cylinder, multiple soldering lugs can be clamped at a time, and therefore the machining efficiency is higher.

Description

technical field [0001] The invention belongs to the technical field of solder preform production, in particular to a burr processing device for solder preforms. Background technique [0002] There are many types of alloys available for solder preforms, and their liquidus ranges from 47°C to 1063°C. There are various alloys such as indium, gold, lead-free, eutectic or standard tin-lead alloys. During the production of solder preforms, because most of the solder chips are punched, it is necessary to deburr the solder chips. The burrs are mainly concentrated at the edges of the solder chips. It also needs to be polished manually. Therefore, there is a need for a deburring device for solder preforms. Invention content: [0003] The purpose of the present invention is to provide a deburring device for solder preforms in order to solve the above problems, which solves the problems mentioned in the background art. [0004] In order to solve the above problems, the present inv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B31/10B24B31/00B24B31/12B24B41/06B24B47/12
CPCB24B31/10B24B31/00B24B31/12B24B41/06B24B47/12
Inventor 王寿银邢鸿伟邢璧凡邢璧元
Owner SHENZHEN XINGHONGTAI TIN