MEMS device in-situ real-time test dock and failure fault tracing method
A real-time testing and device technology, applied in the field of MEMS devices, can solve the problem of not being able to know the type of environmental stress in real time in situ, and achieve the effect of ingenious design and reasonable structure
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Embodiment 1
[0043]An in-situ real-time test dock for MEMS devices, including a test seat board 1, a battery 2, a power management chip 3, a MEMS device 4, a sensor array, an analog-to-digital converter 6, a microprocessor 7, a memory 8, a wireless transmitter 9, Wireless receiver 10, host computer 11;
[0044] The sensor array includes a temperature and humidity sensor 501, an air pressure sensor 502, a magnetic field sensor 503, an altitude sensor 504, a vibration sensor 505, a frequency sensor 506, a voltage collector 507, a current collector 508, and a power collector 509;
[0045] Battery 2, power management chip 3, MEMS device 4, temperature and humidity sensor 501, air pressure sensor 502, magnetic field sensor 503, height sensor 504, vibration sensor 505, frequency sensor 506, voltage collector 507, current collector 508, power collector 509, the analog-to-digital converter 6, the microprocessor 7, the memory 8, and the wireless transmitter 9 are all fixed on the upper surface of t...
Embodiment 2
[0078] An in-situ real-time test dock for MEMS devices, including a test seat board 1, a battery 2, a power management chip 3, a MEMS device 4, a sensor array, an analog-to-digital converter 6, a microprocessor 7, a memory 8, a wireless transmitter 9, Wireless receiver 10, host computer 11;
[0079] The sensor array includes a temperature and humidity sensor 501, an air pressure sensor 502, a magnetic field sensor 503, an altitude sensor 504, a vibration sensor 505, a frequency sensor 506, a voltage collector 507, a current collector 508, and a power collector 509;
[0080] Battery 2, power management chip 3, MEMS device 4, temperature and humidity sensor 501, air pressure sensor 502, magnetic field sensor 503, height sensor 504, vibration sensor 505, frequency sensor 506, voltage collector 507, current collector 508, power collector 509, the analog-to-digital converter 6, the microprocessor 7, the memory 8, and the wireless transmitter 9 are all fixed on the upper surface of ...
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