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Flexible positioning platform of laminated structure adopting cross-layer connection

A technology of flexible positioning and stacked structure, applied to the parts of the instrument, instruments, etc., can solve the problems of increasing the overall thickness and quality of the platform, unfavorable platform miniaturization and lightweight design, and achieve the goal of reducing the thickness and quality of the platform Effect

Pending Publication Date: 2020-12-29
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0002] The stacked parallel structure is one of the commonly used structures of the piezoelectric flexible positioning platform. The ordinary stacked parallel structure in the prior art needs to fix the anchor points for the two-layer bridge amplifiers, so the intermediate layer transfer base is used, but this An additional layer of structure increases the overall thickness and quality of the platform, which is not conducive to the miniaturization and lightweight design of the platform

Method used

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  • Flexible positioning platform of laminated structure adopting cross-layer connection
  • Flexible positioning platform of laminated structure adopting cross-layer connection
  • Flexible positioning platform of laminated structure adopting cross-layer connection

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Embodiment Construction

[0021] The invention discloses a flexible positioning platform adopting a laminated structure connected across layers, comprising a top output platform, a Y-axis working mechanism, an X-axis working mechanism and a platform base, wherein the Y-axis working mechanism and the X-axis working mechanism It is connected with the platform base by a three-dimensional cross connection, so that the central fixed reference hole of the Y-axis working mechanism can be directly fixed and connected to the bottom base, that is, a part of the platform base crosses the X-axis working mechanism, so as to be connected with the Y-axis A certain part of the working mechanism is connected.

[0022] Wherein, the material used in the flexible positioning platform is Al-7075. The flexible structure of the flexible positioning platform includes a Y-axis working mechanism and an X-axis working mechanism, which are processed by metal wire cutting; the thickness of the leaf spring and the flexible hinge ga...

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Abstract

A flexible positioning platform of a laminated structure adopting cross-layer connection comprises a top output platform, a Y-axis working mechanism, an X-axis working mechanism and a platform base, and the Y-axis working mechanism, the X-axis working mechanism and the platform base are connected in a three-dimensional crossing mode. A central fixing reference hole of the Y-axis working mechanismcan be directly and fixedly connected to a bottom-layer base, that is, one part of the platform base crosses over the X-axis working mechanism to be connected with a certain part of the Y-axis workingmechanism. According to the cross-layer connection laminated structure provided by the invention, a cross-layer crossing connection mode is used for replacing the effect of a middle-layer transfer base, so that the thickness and the mass of the platform can be effectively reduced.

Description

technical field [0001] The invention relates to the technical field of precision positioning platform structure design, in particular to a flexible positioning platform and an atomic force microscope system using a laminated structure connected across layers. Background technique [0002] The stacked parallel structure is one of the commonly used structures of the piezoelectric flexible positioning platform. The ordinary stacked parallel structure in the prior art needs to fix the anchor points for the two-layer bridge amplifiers, so the intermediate layer transfer base is used, but this An additional layer of structure increases the overall thickness and quality of the platform, which is not conducive to the miniaturization and lightweight design of the platform. Therefore, there is an urgent need for a more miniaturized and lightweight flexible positioning platform. Contents of the invention [0003] In view of this, the main purpose of the present invention is to provi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G12B5/00
CPCG12B5/00
Inventor 姜行健陈晓梅石俊凯李冠楠刘立拓高超周维虎
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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