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LED lamp bead of glass diffusion cover and manufacturing method of LED lamp bead

A technology of LED lamp beads and manufacturing methods, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., and can solve the problems of small light-emitting angles and small irradiation ranges of LED patch lamp beads

Inactive Publication Date: 2020-12-29
王定锋
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Traditional LED SMD lamp beads are usually packaged with LED chips at the bottom of a cup with a cup holder. The height of the cup is usually between 0.6mm and 2mm, and the luminous angle formed by the cup wall is between 45 degrees and 110 degrees. After the LED chip is energized, the light is irradiated from the front of the lamp bead. Among them, part of the light is directly emitted from the front, and part of the light is reflected through the cup wall. Because the LED chip is at the bottom of the bracket cup, it is limited by the reflection angle of the cup wall, resulting in LED The luminous angle of the SMD lamp bead is not large, and the irradiation range is small

Method used

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  • LED lamp bead of glass diffusion cover and manufacturing method of LED lamp bead
  • LED lamp bead of glass diffusion cover and manufacturing method of LED lamp bead
  • LED lamp bead of glass diffusion cover and manufacturing method of LED lamp bead

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Embodiment Construction

[0019] The present invention will be described in detail below by taking preferred embodiments as examples.

[0020] However, those skilled in the art should understand that the following are only examples and descriptions of some preferred implementations, and other similar or equivalent implementations can also be used to implement the present invention.

[0021] Production of brackets:

[0022] Take the entire roll of copper sheet material 1, and use the designed mold to punch out the entire roll of the LED bracket prototype circuit on the Hongrui 45T high-speed punching machine, such as the positive metal 1.1 and negative metal used to package the LED chip 1.2, punch out multiple holes 1.3 at the same time (such as figure 1 shown).

[0023] Then use Ogilvy's electroplating line to selectively silver-plate the surfaces of the positive metal 1.1 and the negative metal 1.2 in the prototype circuit of the LED bracket.

[0024] Use the designed and manufactured injection mol...

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Abstract

The invention relates to an LED (Light Emitting Diode) lamp bead of a glass diffusion cover and a manufacturing method of the LED lamp bead. The method particularly comprises the following steps of manufacturing the diffusion cover by using glass, adding a dispersing agent into a glass material before the glass diffusion cover is manufactured, melting and dispersing uniformly, then manufacturing the glass diffusion cover with the dispersing agent, braiding on a packaging tape by using a braiding machine, and connecting sheet brackets containing a plurality of LED brackets; packaging an LED chip, applying adhesive glue on an LED bracket, pasting a braided diffusion cover on the glue of the LED bracket of the connected packaged chip by using an SMTT chip mounter, applying external force to firmly adhere, heating to solidify the glue, and slitting a connecting position of the LED bracket to prepare a single LED lamp bead with a glass diffusion cover. The method is advantaged in that emitted light firstly penetrates through the packaging glue, then penetrates through the cavity in the glass diffusion cover and then penetrates through the glass diffusion cover to be emitted to the outside, and under the diffusion effect of the glass diffusion cover, the light-emitting angle is increased after multiple times of refraction and reflection, and the irradiation area is increased.

Description

technical field [0001] The invention relates to the field of LED application, in particular to an LED lamp bead of a glass diffusion cover and a manufacturing method thereof. Background technique [0002] Traditional LED SMD lamp beads are usually packaged with LED chips at the bottom of a cup with a cup holder. The height of the cup is usually between 0.6mm and 2mm, and the luminous angle formed by the cup wall is between 45 degrees and 110 degrees. After the LED chip is energized, the light is irradiated from the front of the lamp bead. Among them, part of the light is directly emitted from the front, and part of the light is reflected through the cup wall. Because the LED chip is at the bottom of the bracket cup, it is limited by the reflection angle of the cup wall, resulting in LED The light emitting angle of the SMD lamp bead is not large, and the irradiation range is small. [0003] In order to overcome the above shortcomings and solve the problem of the small irradi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/54H01L33/58
CPCH01L33/483H01L33/58H01L33/54H01L2933/0033H01L2933/0058
Inventor 王定锋徐文红冉崇友李小龙琚生涛冷求章
Owner 王定锋