Circuit board and manufacturing method thereof
A manufacturing method and circuit board technology, which can be used in printed circuit manufacturing, multilayer circuit manufacturing, printed circuits, etc., can solve problems such as aggravating heat, and achieve the effect of avoiding excessive heat concentration.
Active Publication Date: 2022-03-08
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD +1
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- Abstract
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Problems solved by technology
[0003] With the increase of passive components or / and active components in the circuit board, as well as the increase in the number of antennas, it is bound to increase the heat generation, causing the circuit board to withstand higher heat tests
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[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.
[0022] Some embodiments of the present invention will be described in detail below in conju...
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A circuit board includes a circuit substrate, a heat dissipation medium layer and a grounding circuit board that are stacked in sequence, the heat dissipation medium layer is provided with a conductive structure, and the conductive structure penetrates the heat dissipation medium layer to electrically connect the circuit substrate and the grounding circuit board, an insulating layer is provided on the side of the circuit substrate away from the heat dissipation medium layer, and the circuit board further includes at least one connecting component, the connecting component penetrates through the insulating layer to connect with the circuit The substrates are electrically connected, wherein the height of each connection element gradually increases from the center to the periphery of the connection element. The present invention also needs to provide a manufacturing method of a circuit board.
Description
technical field [0001] The invention relates to a circuit board and a manufacturing method thereof. Background technique [0002] With the development of miniaturization, light weight, high speed, multi-functionality and high reliability of electronic equipment, the semiconductor components in electronic equipment are also developing towards multi-pin and fine-pitch, and it is required to carry semiconductor components. Printed circuit boards are also developing towards miniaturization, light weight and high density. [0003] With the increase of passive components or / and active components in the circuit board, and the increase of the number of antennas, the generation of heat is bound to be aggravated, and the circuit board will bear a higher heat test. Contents of the invention [0004] In view of this, it is necessary to provide a circuit board which is good for heat dissipation and a manufacturing method thereof. [0005] A method for manufacturing a circuit board, c...
Claims
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IPC IPC(8): H05K3/46H05K3/40H05K1/02H05K1/11
CPCH05K3/4611H05K3/4626H05K3/4038H05K1/0218H05K1/0207H05K1/115H05K2201/0108H05K3/007H05K3/4682H05K2201/09854H05K2201/094H05K2203/1383H05K2201/09636H05K1/186H05K1/0204H05K3/4697H05K3/4069H05K3/4623H05K3/4614H05K1/112H05K1/187H05K1/0206
Inventor 高琳洁黄瀚霈
Owner HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD