A kind of display circuit board and its manufacturing method, led display screen
A technology of LED display screen and display circuit, which is applied in the direction of circuits, electrical components, electric solid devices, etc. It can solve the problems of bulky structure and low pixels, achieve high circuit precision, solve current voltage drop and signal attenuation, and reduce drilling The effect of the amount
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2021-07-13
Smart Images

Figure 1 
Figure 2 
Figure 3
Abstract
Description
technical field
[0001] The invention relates to the technical field of LED display screens, in particular to a display circuit board, a manufacturing method thereof, and an LED display screen. Background technique
[0002] With the development of LED display technology, micro-pitch LED (miniLED) display has gradually occupied an important position in the LED display technology industry due to its small spacing, clear display screen, and low power consumption. Most of the LED displays are spliced by multiple display modules. Each display module includes a PCB board and at least one light board fixed on the PCB. The light board is equipped with multiple full-color RGB (red, yellow, blue) Three primary colors) LED lights, each light board is equipped with an external constant current drive circuit board, the constant current drive circuit board and each display module are connected to the HUB board through a transmission cable to realize receiving and transmitting control sig...
Examples
Embodiment 1
[0053] Embodiment 1 of the present invention provides a display circuit board. see Figure 1 to Figure 3 , the display circuit board includes a glass substrate 10 , a plurality of flip-chip bare-chip LED light-emitting chips 20 , a plurality of bare-chip constant current drive chips 30 and a control element 40 .
[0054]The glass substrate 10 can be a TFT glass substrate with a thickness of 0.3 mm to 2.0 mm, and its front is provided with a first circuit layer 111 , an intermediate insulating layer 112 , a second circuit layer 113 and a first surface insulating layer 114 in sequence. A third circuit layer 121 and a second surface insulating layer 122 are provided on the back of the glass substrate 10 .
[0055] In practical applications, the thickness of the insulating layer is about 0.1um-10um, and the thickness of the circuit layer is about 1um-35um.
[0056] The glass substrate 10 is also provided with a plurality of conductive holes (such as the first conductive hole 131...