Method for improving vibration reliability of airborne case

Abstract

The invention provides a method for improving the vibration reliability of an airborne case. The method comprises the following steps: 1, simplifying small parts and small features on the airborne case, and building a numerical model of the airborne case; 2, determining an external excitation load borne by the airborne case based on the airborne environment working condition; 3, establishing a finite element simulation model of the airborne case; 4, based on the finite element theory, using finite element software to conduct a numerical simulation test, including modal analysis and harmonic response analysis of basic excitation, on the airborne case, and obtaining modal characteristics and a dynamic response result of the airborne case; and 5, determining a resonance point of the airbornecase according to the dynamic response result to evaluate the vibration stability of the airborne case, checking whether the stress and amplitude results of the airborne case meet the requirements ornot, changing the mass distribution and rigidity distribution of the airborne case by changing the structural geometry, materials and the like of the airborne case so as to improve the vibration characteristics of the airborne case, and the vibration reliability of the airborne case is ensured.

Description

technical field [0001] The invention belongs to the technical field of airborne electronic equipment chassis, and in particular relates to a method for improving the vibration reliability of an airborne chassis. Background technique [0002] The airborne electronic equipment chassis is the basis for the on-site work of the equipment, providing a good operating environment for the components and groups inside the airborne chassis that can resist the harsh external conditions. The airborne electronic equipment chassis usually undergoes the process of engineering site work, transportation and installation, which makes the airborne electronic equipment chassis in a complex load environment with severe vibration and shock. These basic vibrations will cause loose solder joints of components, open circuits and components At present, this kind of problem has become one of the main reasons for system failure. With the development of miniaturization and precision of electronic compon...

AI Technical Summary

Problems solved by technology

Most of the traditional chassis structures are designed based on theoretical calculations and experiences, and only give the resonance frequency domain of the airborne electronic equipment chassis products, resulting in restrictions on the use of airborne electronic equipment chassis

However, modern engineering has higher and higher requirements for products, electronic components are constantly developing in the direction of miniaturization and precision, and the application environment is becoming more and more complex. Traditional methods can no longer meet the reliability requirements of airborne electronic equipment chassis.

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