Design method of LTCC substrate embedded resistor with adjustable value

Abstract

The invention discloses a design method of an LTCC substrate embedded resistor with an adjustable value, and the method comprises the steps of optimizing the design of the embedded resistor, designingthe embedded resistor into a series resistor network, and enabling the interconnection relation between resistors to be presented on a surface layer through interlayer interconnection, i.e., either be a bottom surface layer or a top surface layer of a substrate; and finally, interrupting the interconnection of the surface layer selectively through laser, so that the value of the embedded resistoris adjusted, and the precision of the embedded resistor and the yield of the substrate are improved. Under the condition that a process platform is not changed, a method for optimizing embedded resistor design is adopted, embedded resistors are designed into a series resistor network, the interconnection relation between the resistors is presented on a surface layer through interlayer interconnection, and finally, the interconnection of the surface layer is selectively interrupted through laser, so that the value adjustment of the embedded resistors is realized, and the precision of the embedded resistor and the yield of the substrate are improved. The invention has remarkable effects of popularizing the use of the embedded resistor and improving the integration level and the yield of theLTCC substrate.

Description

technical field [0001] The invention relates to a design method of an LTCC substrate, in particular to a design method of an adjustable, high-precision LTCC substrate embedded resistance. Background technique [0002] LTCC (low temperature co-fired ceramic) substrate has the characteristics of high three-dimensional wiring density, small wiring square resistance, low sintering temperature, embedded integrated resistors, capacitors and other components, and high-frequency transmission performance, and has become an ideal multi-chip component. Mainstream substrates used. In particular, it is easy to realize embedded integration of passive devices such as resistors, capacitors, and inductors, thereby improving design flexibility and system integration, and reducing system volume, which is a significant feature superior to ordinary thick and thin film substrates. [0003] For manufacturing resistors on LTCC substrates, there are three ways: top-layer co-firing, top-layer post-f...

AI Technical Summary

Problems solved by technology

However, it has higher requirements for the entire process control, and the accuracy is still lower than that of the laser adjustable value, which is difficult to meet the use requirements.

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