Lamp string manufacturing method and lamp string

Abstract

The invention provides a lamp string manufacturing method. The manufacturing method comprises the following steps: providing A-type light-emitting chips and B-type light-emitting chips; sequentially and alternately arranging the A-type light-emitting chips and the B-type light-emitting chips, and arranging four leads which are arranged at intervals and basically extend along the arrangement direction of the chips; and cutting off a lead connecting the first signal input bonding pad of the adjacent upstream A-type light emitting chip and the second signal output bonding pad of the adjacent downstream B-type light emitting chip, and cutting off a lead connecting the second signal input bonding pad of the adjacent upstream B-type light emitting chip and the first signal output bonding pad ofthe adjacent downstream A-type light emitting chip. The manufacturing efficiency of the lamp string with the signal transmission function can be improved.

Description

technical field [0001] The invention relates to the technical field of light strings, in particular to a method for making a light string and the light string. Background technique [0002] The light string is obtained by connecting a plurality of light-emitting lamp beads in series in sequence. Through the series connection, the power supply provides electric energy for each light-emitting light bead. Most of the existing series connection methods are to connect the positive pad of the previous light-emitting chip to the negative pad of the next light-emitting chip, and then circulate the light string in turn, and then realize the light emission of the light string by inputting high-voltage current. This series connection requires The use of higher voltage current consumes more energy, which is not applicable in some scenarios, and because there is no signal, the light emission of each light-emitting chip cannot be controlled. Although some light-emitting chips are connect...

AI Technical Summary

Problems solved by technology

Most of the existing series connection methods are to connect the positive pad of the previous light-emitting chip to the negative pad of the next light-emitting chip, and then circulate the light string in turn, and then realize the light emission of the light string by inputting high-voltage current. This series connection requires The use of higher voltage current consumes more energy, which is not applicable in some scenarios, and because there is no signal, the light emission of each light-emitting chip cannot be controlled

Although some light-emitting chips are connected to the signal line, the welding of the signal line is more troublesome. For example, the double-input serial cascaded anti-reverse connection circuit disclosed in CN109219196A and the LED light bar using this circuit, each light-emitting chip needs to be separately grounded. Solder signal wire

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