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Rapid thermal calibration device for Pin Fin substrate

A technology of thermal calibration and substrate, which is applied in the direction of measuring devices, electric devices, and thermometers using electric/magnetic elements that are directly sensitive to heat, can solve problems such as inaccurate measurement, shorten calibration time, reduce volume, Effect of Improving Calibration Efficiency

Inactive Publication Date: 2021-01-08
华电(烟台)功率半导体技术研究院有限公司
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  • Abstract
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  • Claims
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Problems solved by technology

[0005] In order to overcome the existing defect that the calibration of the electromagnetic heating plate cannot accurately measure the defect of the Pin Fin packaged power module substrate with a pin-fin heat dissipation structure, the present invention discloses a thermal calibration device for the Pin Fin substrate, which adopts electromagnetic heating and sand bath method , to accurately and efficiently thermally calibrate the Pin Fin substrate, the technical solution adopted is:
In this way, the heat is more evenly distributed throughout the tank

Method used

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  • Rapid thermal calibration device for Pin Fin substrate

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Embodiment 1

[0017] Example 1, such as figure 1 A rapid thermal calibration device for Pin Fin substrates shown includes an electromagnetic heating plate 1, an iron plate 3 is arranged between the electromagnetic heating plate 1 and the tank body 2, and the upper surface of the iron plate 3 is in contact with the groove body The lower surface of the body 2 abuts, and the lower surface of the iron plate 3 abuts against the upper surface of the electromagnetic heating plate 1 .

[0018] The tank body 2 is an aluminum tank with a depth of 20 mm. The tank body 2 is covered with fine sand 5, and the Pin Fin substrate 4 to be measured is buried in the fine sand 5.

[0019] How to use this device:

[0020] First, fill the aluminum tank body 2 with a depth of 20mm with fine sand, pave the fine sand, fully wet the sand with pure water, and press the Pin Fin substrate IGBT 4 into the water-containing sand.

[0021] Then extend three thermocouples along the shell surface of the Pin Fin substrate, ...

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Abstract

The invention belongs to the technical field of semiconductors and relates to a rapid thermal calibration device for a Pin Fin substrate. The device comprises an electromagnetic heating plate. The rapid thermal calibration device is characterized in that the upper surface of the electromagnetic heating plate directly or indirectly abuts against the lower surface of a groove body with good heat conduction; the groove body is filled with fine sand; a Pin Fin substrate to be measured is buried in the fine sand. Compared with the prior art, the rapid thermal calibration device for the Pin Fin substrate shortens calibration time and improves calibration efficiency.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a rapid thermal calibration device for Pin Fin substrates. Background technique [0002] Pin Fin packaged power semiconductor devices are mainly used in electric vehicle applications. They have the characteristics of high power density and high heat dissipation efficiency, and have gradually become the packaging development trend of power semiconductor devices for high power density motor controllers. [0003] Junction temperature is a key parameter of power semiconductors. Whether in actual operating conditions or in experimental research, junction temperature is a thermal quantity of real-time concern. Commonly used methods for monitoring junction temperature include infrared thermal imaging and temperature-sensitive electrical parameter methods. The temperature-sensitive electrical parameter method is widely used because it is easy to measure in real time, the circuit i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26G01K7/02
CPCG01K7/02G01R31/2603
Inventor 邓二平赵雨山陈杰谢露红黄永章
Owner 华电(烟台)功率半导体技术研究院有限公司
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