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High-speed peripheral system and control method thereof

A control method and high-speed technology, applied in the field of microelectronics, which can solve the problems of correctly receiving data, failure of the secondary chip, and failure of the main chip to obtain data at the time of design.

Active Publication Date: 2021-01-12
博流智能科技(南京)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Figure 4 It is a schematic diagram of the main chip writing to the sub-chip through multiple pins at high speed. The signal seen on the sub-chip, because the delay of each pin and the wiring is not completely aligned, the sub-chip cannot receive it correctly at the same clock. every bit of data
[0009] (2) Receive delay drift
Generally, the sub-chip manual only defines the maximum delay inside the chip, but there is no good way to measure the real delay of the actual sub-chip, and the receiving delay on the pin will drift with the process, and the working environment temperature is high or low. , voltage level, clock speed, and change; because the cycle of high-speed peripherals is very short, once the delay drifts, it will make it impossible for the main chip to get the data at the designed time point
For example Figure 5 Originally, the main chip was designed to read the data returned by the secondary chip at 2T, but in fact, after the receiving delay drifts backward, it needs to wait until 2.5T to read the data correctly
[0010] (3) Transmission delay drift
Figure 6 It is a schematic diagram of a peripheral interface. The main chip is designed to send instructions at clock 0T, while the sub-chip fetches instructions at 0.5T, and fetches data at 1.5 and 2.5T. However, the real sub-chip sees that the signal is routed through the pins. The delay drifts back and forth at the intersection of 0.5T, and every time the secondary chip fetches data at 0.5T, 1.5T, and 2.5T, it will fetch data that is being converted unstable and an error will occur

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Embodiment Construction

[0083] Preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0084] In order to further understand the present invention, the preferred embodiments of the present invention are described below in conjunction with examples, but it should be understood that these descriptions are only to further illustrate the features and advantages of the present invention, rather than limiting the claims of the present invention.

[0085] The description in this part is only for several typical embodiments, and the present invention is not limited to the scope of the description of the embodiments. The mutual replacement of the same or similar prior art means and some technical features in the embodiments is also within the scope of the description and protection of the present invention.

[0086] "Connection" in the specification includes both direct connection and indirect connection.

[0087] The invention discloses...

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Abstract

The invention discloses a high-speed peripheral system and a control method thereof, the high-speed peripheral system comprises a first chip and a second chip, and the first chip is connected with thesecond chip, wherein the first chip comprises a first emitter, a first receiver, a clock generator, a clock regulator, at least one emission buffer unit, at least one emission delay regulator, at least one reception buffer unit and at least one reception delay regulator; the second chip comprises a second receiver and a second emitter. According to the high-speed peripheral system and the controlmethod thereof provided by the invention, the delay measurement precision can be improved on the premise of low cost.

Description

technical field [0001] The invention belongs to the technical field of microelectronics and relates to a peripheral system, in particular to a high-speed peripheral system and a control method thereof. Background technique [0002] With the continuous evolution of semiconductors, many semiconductor components are developing toward specialized division of labor; for example, common memory, storage and other chips on the market are usually separated from the main chip, and finally use peripheral interfaces to connect the chips together. At the same time, with the rapid development of consumer electronics products in recent years, in order to improve the user experience, more and more software application functions are required, and the calculation delay is also required to be shorter and shorter. Therefore, the main chip uses the peripheral interface to transmit data among the chips. bandwidth requirements are getting higher and higher. [0003] The common way is to increase ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
CPCG01R31/2851G01R31/2834Y02D10/00
Inventor 蔡尚达彭成斌刘钊
Owner 博流智能科技(南京)有限公司