81results about How to "Increased cost of testing" patented technology

An automatic pricing method and apparatus for use in electronic commerce environments is described. Automatic pricing uses live price testing to estimate and measure demand for specific products—taking into account where appropriate, a vendor selected segmentation scheme. The results of live price testing are compared using a vendor selected goal function, e.g. profit maximization, to select a new price. A goal function that balances short term gains versus long term gains based on customer lifetime value is described. The live price testing approach used is designed to minimize losses due to price testing through statistical methods. Additionally, methods for distributing price testing across time so as to avoid problems caused by too many ongoing tests as well as side effects from testing are described. The selected price is a win for both purchasers and vendors as the automatic price will approximate the efficiency of a reverse auction without the inconvenience of the auction format while being goal maximizing for the vendor. For example, a vendor that normally sets prices of items for sale to customers can use embodiments of the invention to great effect.

A STE for automated testing of ground combat vehicle software application to validate vehicle software logic provides a system and method to conduct interactive (manual) testing of the vehicle software while under development, record information related to the interactive testing activities, including but not limited to tester inputs and expected outcomes, and perform automated testing of the combat vehicle software application using the recorded information. Preferably, reconfiguration of the STE to support changes that arise due to the evolution of the combat vehicle software application system and the subsystems under control of the evolving software system is provided.

A method and apparatus of temperature compensation for an integrated circuit using on-chip circuits, sensors, and an algorithm. The chip includes an on-chip reference circuit, an on-chip sensor measuring a parameter relative to the reference, and an on-chip computation means for processing an algorithm. A supplemental off-chip reference circuit is also used. The algorithm carries out the following steps: (A) performing a first calibration of an internal reference residing in an integrated circuit system on-chip at a first (higher) temperature at a first testing site, and (B) utilizing calibration data obtained at the step (A) to perform a second calibration of the internal reference source residing on the integrated system on-chip at a second (lower) temperature at a second testing site.

In an optical semiconductor device related to the present invention, a first light source outputting light having a first polarization, a second light source outputting light having a second polarization, a first optical modulator being optically connected to an output side of the first light source and modulating the light that is output from the first light source to output a light signal, a second optical modulator being optically connected to an output side of the second light source and modulating the light that is output from the second light source to output a light signal, and an optical multiplexer coupling the light signal that is output from the first optical modulator with the light signal that is output from the second optical modulator to output a coupled light signal, are integrated on a semiconductor substrate together.

The invention relates to a gelatin backing material deformation measuring apparatus on the condition of multi-environment. It comprises an environment analog case (10), a table seat (14), a displacement sensor, a temperature sensor, a computer and a copper measuring head (34), which is characterized in that the displacement apparatus is positioned on the environment analog case (10); two displacement sensor measuring heads (25) are separately fixed on the brace (24) of the moving device whose left height can be adjusted and the brace (42) whose right height can be adjusted; the moving device comprises a motor (18), a guide screw (21), a bearing (24), a first bearing seat (17), a second bearing seat (23), a num (22), a right steel plate (15), a left steel plate (41), a brace (24) whose right height can be adjusted and a brace (42) whose right height can be adjusted.

A memory test is carried out on semiconductor integrated circuit devices including a semiconductor memory at low cost with efficiency. In a test burn-in system, twenty-four test boards are processed in sequence with time differences, and the test boards are circulated one by one. In this case, the memory test is conducted with the sequence of single board processing: the test is started with a test board in which semiconductor integrated circuit devices have been embedded, and semiconductor integrated circuit devices are discharged, beginning with a test board that has undergone the test.

A boot test system applied to test a cold boot in a target computer is provided. The boot test system includes a host computer and an autorun module. The host computer is used to test the target computer to turn power on/off and output a power-on signal and a power-off signal to the target computer based on a feedback signal. The autorun module installed in the target computer is used to output the feedback signal to the host computer during the boot of the target computer. Whereby, the present invention retains a fail result of the boot of the target computer for debugging by a worker.

The invention discloses an operational amplifier offset self-calibration circuit applied to a voice coil motor driver chip. The operational amplifier offset self-calibration circuit comprises an operational amplifier (OPAMP), a counting latch, a comparator, an oscillator and a digital analog converter for calibration (DAC), wherein the output end of the OPAMP is connected with the negative pole input end of the comparator; the output end of the comparator is connected with the input end of the oscillator and one input end of the counting latch; the output end of the oscillator is connected with another input end of the counting latch; the output end of the counting latch is connected with the input end of the DAC for calibration; the output end of the DAC for calibration is connected witha signal feedback end of the OPAMP; and the input end and the output end of the OPAMP are further respectively connected with the voice coil motor driver chip. The offset of the OPAMP can be eliminated or greatly decreased, the accuracy of output current of the motor driver chip is improved, the service time of the system battery is prolonged, and the condition that the chip development and test cost is increased due to offset calibration by using a fuse wire is avoided.

A semiconductor integrated circuit system comprises a semiconductor memory device including a memory cell array having a plurality of memory cells; a monitor circuit for monitoring characteristics of the memory cells; and a voltage output circuit connected to the semiconductor memory device to supply a power supply voltage to the semiconductor memory device; the voltage output circuit being configured to change an output voltage according to an output of the monitor circuit.

A semiconductor device includes: an A/D converter; a digital processing circuit for performing processing based on conversion results from the A/D converter; a first test circuit for performing operation processing for checking a nonlinearity error (INLE) of the conversion results from the A/D converter; and a second test circuit for performing operation processing for checking a differential nonlinearity error (DNLE) of the conversion results from the A/D converter. The first test circuit performs only part of the operation processing for checking the nonlinearity error (INLE) of the conversion results from the A/D converter. The second test circuit performs only part of the operation processing for checking the differential nonlinearity error (DNLE) of the conversion results from the A/D converter. An operation processing section for performing the rest of the operation processing for checking the nonlinearity error (INLE) and the rest of the operation processing for checking the differential nonlinearity error (DNLE) is in a semiconductor test device.

The invention discloses a device and a method for testing wafers. The wafer testing device comprises a set of composite probe cards, wherein the composite probe cards comprise at least one group of measurement probe cards, and the measurement probe cards comprise measurement probes used for measuring electrical signals of corresponding wafers and at least one group of fusing probe cards; the fusing probe cards comprise fusing probes used for trimming or programming corresponding wafers; when the composite probe cards are placed at the same position, various groups of probe cards respectively correspond to different wafers, so that during wafer testing, a measurement process and a fusing process of the same wafer are separately carried out, and the measurement precision is improved; moreover, because the measurement processes and the fusing processes of different wafers can be simultaneously carried out, occupied time of a testing machine is never prolonged excessively, and testing cost is proportional to testing time; and according to the device and the method, the measurement precision is improved, but the testing cost is never increased excessively.

The invention relates to a non-invasive automatic test system for subway signal system test software, and the system comprises an OCR image processing module which is used for recognizing and processing the information in a subway signal system test software interface; an image data acquisition module which is used for monitoring and acquiring a to-be-processed picture with test interested information in the graphical interface of the subway signal system test software in real time; a test script configuration module which is used for setting a test process; a client intranet inter-network communication module which is used for meeting the multi-machine linkage test requirement; a log processing module which is used for performing test logic comparison; and a test result visualization module which is used for visualizing the output result of the test logic. Compared with the prior art, the method has the advantages that the problems that subway signal system testing software depends too heavily on testing personnel and does not support automatic testing are solved, improvement of full automation of subway signal system testing is facilitated, promotion of the automation process ofa subway is facilitated, and the development and testing cost is reduced.

The invention discloses a control system of Internet-of-Things household electric appliances. The control system includes a household electric appliance control end, a server and a client; the household electric appliance control end is provided with a protocol code file; the protocol code file records functional functions which can be called by the household electric appliance control end, the server and the client; and the server and the client obtains the protocol code file from the household electric appliance control end and realizes interaction between the client, the server and the household electric appliance control end based on the protocol code file. The invention also discloses a control method of Internet-of-Things household electric appliances. With the control method and system of the invention adopted, development cost and test cost increase caused by a situation that each terminal maintains respective codes can be avoided.

A system for testing a DC power supply performance includes a load module electrically coupled to the DC power supply, a switch module electrically coupled to the DC power supply, a control module electrically coupled to the load module and the switch module respectively, and an indication module electrically coupled to the control module. The control module includes a judge module and a comparison module. The judge module is configured for receiving DC voltage signals from the DC power supply; wherein the judge module is capable of turning on when the DC power supply is normal. The comparison module is configured for comparing the DC voltage signals with a reference voltage; wherein the comparison module is capable of outputting a control signal when the DC voltage signals are greater than the reference voltage. The indication module is configured for receiving the control signal and indicating status of the DC power supply.

A voice coil motor (VCM) includes a lens carrier physically connected to a magnetic device, an electromagnetic driving apparatus, constructed by a coil, a magnetic sensing element, a storage media and a controller. The magnetic sensing element detects a location of the lens carrier and outputs the location value relating to the location of the lens carrier via an amplifier. The storage media stores a gain value and an offset compensation value relating to the amplifier. The controller can make the lens carrier move between a top position and a bottom position in which the lens carrier can be moved within the voice coil motor. The lens carrier is moved using the coil interaction with a magnetic field of the magnetic device when current is applied to the coil.

Cost of testing is reduced. An SiP (1) comprises an AD chip (2) and a logic chip (3) that perform transmission and reception of data. The AD chip (2) comprises AD conversion circuits (12a and 12b) that generate parallel data, parallel-serial conversion circuits (13a and 13b) that divide parallel data generated by the AD conversion circuits (12a and 12b) and perform time-based sorting, and selection circuits (14a and 14b) that select any of: output data of the parallel-serial conversion circuits (13a and 13b), or divided data obtained by dividing the parallel data so as to enable transmission of each thereof by said plural paths, and output to the logic chip (3). The logic chip (3) comprises serial-parallel conversion circuits (15a and 15b) that recover original parallel data from data sorted in a time-based manner, and a selection circuit (16) that selects: original parallel data obtained by combining the divided data, or original parallel data recovered by the serial-parallel conversion circuits (15a and 15b), and outputs to a terminal (18).

The present invention comprises first and second differential pairs (MN31, MN32), (MN33, MN34) to which first and second differential input signals (CIB0, CIT0), (CIB90, CIT90) are input, output pairs of said first and second differential pairs being commonly connected to each other, further connected to load circuits (MN1 to MN4) and connected to differential output terminals (OUTT, OUTB); first to fourth current sources (MN1 to MN4); and first to fourth switch pairs (MN11, MN21), (MN12, MN22), (MN13, MN23), (MN14, MN24). Switches on one side of said first to N-th switch pairs are connected at one end thereof to said first to fourth current sources and are commonly connected at the other end thereof to said second differential pair. Control signals PICT [3:0], PICB [4:0] are connected to control terminals of said first to N-th switch pairs, so that a pattern is applied to the control signal. The operation of the current sources can be confirmed by a functional test in which output signals are compared with expected values.

A testing method for a fan module is provided. When the fan module is tested, a testing computer sends a testing command to a testing device first. Then, the testing device respond to the testing command and controls the fan module to work in a plurality of rotational speed modes in sequence. The testing device reads an actual rotational speed when the fan module works in one of the rotational speed modes and sends the actual rotational speed back to the testing computer. The testing computer compares the actual rotational speed with a corresponding reference rotational speed value stored in the testing computer, and determines the testing result. Finally, the testing result is shown.

A testing system includes a computer, a connection cord, and a number of oscillographs. The each oscillograph has a GPIB port. The computer has a USB port. The connection cord has a USB connector for connection with the USB port and a GPIB connector for selectively connecting to a GPIB port of one of the oscillographs. The computer includes an oscillograph model displaying module, an oscillograph driving module, a storage module, and a testing interface module. The oscillograph model displaying module displays a number of oscillograph models for a user to select. The oscillograph driving module loads an oscillograph driver corresponding to the selected oscillograph model. The storage module stores a plurality of codes associated with a number of testing functions for different oscillographs. The testing interface module transmits the codes to the oscillograph, thereby driving the oscillograph to perform the associated testing functions to test a device.

The invention discloses a high-precision double-forming-mode 3D printer and a forming method thereof. The high-precision double-forming-mode 3D printer comprises a frame support structure, a plane mechanical motion structure, a piezoelectric micro nozzle structure and a powder forming bin which is inlaid in the upper surface of the frame support structure. A detachable gluing forming bin is arranged in the powder forming bin. A powder forming platform, a gluing forming platform and a vertical mechanical motion structure are arranged on the lower portion correspondingly, and the vertical mechanical motion structure drives the platforms to move. The plane mechanical motion structure, the piezoelectric micro nozzle structure and the vertical mechanical motion structure are connected to mastercontrol circuit control unit. According to the high-precision double-forming-mode 3D printer and the forming method thereof, the gluing forming bin is selectively installed in the powder forming bin,so that forming printing of different types of forming materials can be achieved; and through the piezoelectric glass combined micro nozzle structure, controllability of printing ink quantity can beimproved significantly, and the high-precision double-forming-mode 3D printer is particularly suitable for powder bonding of single-nozzle large ink quantity or gluing reflecting 3D printing forming.