LTCC integrated refrigeration system based on heat pipe and thermoelectric cooler and its manufacturing method

Abstract

The invention discloses an LTCC integrated refrigeration system based on a heat pipe and a thermoelectric cooler, comprising: a thermoelectric cooler, a heat pipe assembly, and a lower tile, a middle tile, and an upper tile sequentially arranged from bottom to top; The installation through hole; the thermoelectric cooler is fixed in the installation through hole; a plurality of heat conduction through holes are opened on the middle ceramic sheet; the heat conduction through holes are filled with metal columns; the lower ceramic sheet is provided with an installation groove; the heat pipe assembly is located in the installation groove The inside and the external cooling device are connected; the upper end of the metal column is in contact with the hot end of the thermoelectric cooler. The LTCC integrated refrigeration system based on the heat pipe and the thermoelectric cooler of the present invention can quickly and effectively cool the heat source chip through the thermoelectric cooler and the heat pipe assembly, so that the heat source chip can continue to work at a suitable low temperature, and solve the problem of poor heat dissipation of the LTCC substrate problem, improving the heat dissipation performance of the LTCC substrate. The invention also discloses a manufacturing method of the LTCC integrated refrigeration system based on the heat pipe and the thermoelectric refrigerator.

Description

technical field [0001] The invention belongs to the technical field of semiconductor hybrid integrated circuits, and in particular relates to an LTCC integrated refrigeration system based on a heat pipe and a thermoelectric refrigerator and a manufacturing method thereof. Background technique [0002] With the rapid development of microelectronics technology and the miniaturization of electronic products, low temperature co-fired ceramics (Low Temperature Co-fired Ceramic, LTCC) with high-density integration characteristics have become the mainstream technology of passive integration. High-density packaging of chips and passive devices, LTCC has good high-frequency characteristics, low thermal expansion coefficient, high yield, and can adapt to high-current and high-temperature environments. It has broad application prospects in the field of system integration. [0003] LTCC technology was initially applied in military and avionics communication and radar systems, and was la...

AI Technical Summary

Problems solved by technology

However, microchannels cannot achieve refrigeration, and the introduction of microchannels has brought many other problems: (1) When preparing microchannels, it is necessary to fill them with sacrificial materials. Precise fit, which brings difficulty to the process, precise machining is very difficult and it is difficult to accurately fill into the micro-channel

(2) If the sacrificial material is improperly prepared and cannot match the ceramic properties of the LTCC material, it may cause serious problems such as collapse and deformation of the substrate

(3) The size of the microchannels currently prepared by the process is limited

At the same time, micro-channel technology needs to introduce heat transfer fluid into the system, and the system is large in volume, which is difficult to meet the cooling requirements of LTCC microsystems

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