Back drill measuring device and circuit board
A measurement device and back-drilling technology, applied in the direction of measurement devices, printed circuits, printed circuit manufacturing, etc., can solve the problems of circuit board damage, low efficiency of circuit board measurement, time-consuming and labor-intensive, etc., to improve measurement efficiency and avoid The effect of measurement result deviation and simple operation
Active Publication Date: 2022-07-26
HUIZHOU TECHUANG ELECTRONIC TECH CO LTD
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Problems solved by technology
In this process, the machine needs to wait for the slicing results before compensating for production, which consumes a lot of time and human energy, and can only obtain the profile depth information. In addition, this method is a destructive detection method, which is easy to cause damage to the circuit board, and at the same time causes the circuit board to be damaged. The measurement efficiency is low
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[0031] In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the related drawings. The preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that a thorough and complete understanding of the present disclosure is provided.
[0032] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for the purpose of illustration only ...
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The present application provides a back drill measurement device and a circuit board. The above-mentioned back drill measuring device includes a glue dispensing control assembly, a glue liquid accommodating member, a piston member, a glue dispensing assembly and a measuring mechanism. The glue dispensing assembly includes a glue gun and a heating gun. After the glue is injected into the back hole through the glue gun, the glue is directly cured with the heating gun, and then the cured glue is taken out, and the glue is directly measured on-site by the measuring mechanism. Obtain data and quickly confirm the depth of back drilling, which greatly improves the measurement efficiency. The glue is injected into the back-drilled hole through the glue dispensing control component, the glue container and the glue dispensing component, and the glue is cured by the heating gun in the dispensing component and then taken out, and then the cured glue is measured by the measuring component. Take a measurement to get the back-drilled depth without doing anything to the board during the measurement. The invention has the advantages of simple operation, high measurement efficiency, accurate measurement accuracy and no damage to the circuit board.
Description
technical field [0001] The invention relates to the technical field of printed circuit board fabrication, in particular to a back drill measuring device and a circuit board. Background technique [0002] In the production process of the circuit board, it is necessary to realize the conduction between the layers of the circuit through the through hole, and the through hole is usually processed by the drilling machine, and then through the copper sinking, electroplating and other processes, the conductive layer is formed in the through hole. Implement electrical connections between different layers. However, the ends of some plated through-holes are not connected, which will lead to the foldback of the signal, causing reflection, scattering, delay and other phenomena of the signal, thus bringing about the problem of signal distortion. In order to solve this problem, it is necessary to further process the through holes of the circuit board, that is, a back-drilling process, th...
Claims
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IPC IPC(8): B05C17/005G01B11/22H05K3/00
CPCB05C17/00533B05C17/0052G01B11/22H05K3/0047
Inventor 许校彬陈金星
Owner HUIZHOU TECHUANG ELECTRONIC TECH CO LTD