Housing assembly, antenna assembly and electronic device

A technology of antenna components and housing components, which is applied in the directions of antenna parts, antennas, antenna coupling, etc., can solve the problems of poor communication performance of millimeter wave signals, and achieve the effect of increasing bandwidth and improving communication performance

Active Publication Date: 2022-01-11
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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Problems solved by technology

[0003] The present application provides a shell assembly, antenna module and electronic equipment to solve the technical problem of poor communication performance of traditional millimeter wave signals

Method used

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  • Housing assembly, antenna assembly and electronic device
  • Housing assembly, antenna assembly and electronic device
  • Housing assembly, antenna assembly and electronic device

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Embodiment Construction

[0052] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0053] See 1, figure 1 It is a schematic structural diagram of the housing assembly provided in the first embodiment of the present application. The housing assembly 100 includes a dielectric substrate 110 and a coupling structure 120 . The dielectric substrate 110 has a first transmittance to preset dual-band radio frequency signals. The coupling structure 120 is carried on the dielectric substrate 110 and covers at least a part of the dielectric substrate 110. The coupling struc...

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Abstract

The application provides a housing assembly, an antenna assembly and electronic equipment. The housing assembly includes a dielectric substrate and a coupling structure. The dielectric substrate has a first transmittance for preset dual-band radio frequency signals; the coupling structure is carried on the dielectric substrate and covers at least a part of the dielectric substrate, and the coupling structure includes one or more Layer coupling element array layer, the coupling element array layer has resonance characteristics under the preset dual frequency band; the housing component is in the area corresponding to the coupling structure, and the radio frequency signal of the preset dual frequency band It has a second transmittance, and the second transmittance is greater than the first transmittance.

Description

technical field [0001] The present application relates to the field of electronic equipment, in particular to a housing assembly, an antenna assembly and electronic equipment. Background technique [0002] With the development of mobile communication technology, traditional fourth-generation (4th-Generation, 4G) mobile communication cannot meet people's requirements. The fifth generation (5th-Generation, 5G) mobile communication is favored by users due to its high communication speed. For example, when using 5G mobile communication to transmit data, the transmission speed is hundreds of times faster than that of 4G mobile communication. Millimeter wave signals are the main means to realize 5G mobile communication. However, when millimeter wave antennas are applied to electronic equipment, millimeter wave antennas are usually set in the storage space inside the electronic equipment, and the millimeter wave signal antenna radiates out through the electronic equipment. The tr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/22H01Q1/38H01Q1/50H01Q1/52H01Q5/50
CPCH01Q1/52H01Q5/50H01Q1/38H01Q1/22H01Q1/50H01Q1/521
Inventor 贾玉虎
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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