Thermally conductive silicone composition and method for producing same
A technology of thermal conductivity and silicone, which is applied in the direction of chemical instruments and methods, heat exchange materials, coatings, etc., can solve problems such as thermal conductivity silicone compositions that have not yet been obtained, and achieve excellent offset resistance and coating properties excellent effect
Active Publication Date: 2021-01-15
SHIN ETSU CHEM IND CO LTD
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Problems solved by technology
However, a thermally conductive silicone composition capable of sufficiently improving the performance of the electronic-electric components used has not yet been obtained.
Method used
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Embodiment
[0113] Examples and comparative examples are shown below to describe the present invention in detail, but the present invention is not limited by the following examples. In addition, the viscosity of (A), (B) component, and a silicone composition is the value in 25 degreeC measured with the Macon viscometer shown below.
[0114] Components used in Examples and Comparative Examples are described below.
[0115] [Addition reaction catalyst]
[0116] Chloroplatinic acid H 2 PtCl 6 ·6H 2 8.0 g of O (37.6% by mass platinum) was placed in a 100 mL reaction flask equipped with a reflux condenser, a thermometer, and a stirring device, and then 40.0 g of ethanol and 16.0 g of divinyltetramethyldisiloxane were added. After heating and reacting at 70° C. for 50 hours, while stirring the reaction mixture at room temperature, 16 g of sodium bicarbonate was gradually added and neutralized for 2 hours. The reaction mixture was suction-filtered, and the filtrate was distilled off under r...
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Abstract
The present invention provides a thermally conductive silicone composition which contains: an organopolysiloxane which is a reaction product obtained by reacting (A) an organopolysiloxane having an alkenyl group bonded to a silicon atom and (B) an organohydrogen polysiloxane with each other at a molar ratio of the Si-H group in the component (B) to the alkenyl group bonded to a silicon atom in thecomponent (A), namely (Si-H / Si-Vi) of 2.0-9.0; (C) an inorganic filler which is selected from among metal oxides and metal nitrides, and which has an average particle diameter of 3 [mu]m or less; and(D) a thermally conductive inorganic filler which has an average particle diameter of 5 [mu]m or more. This thermally conductive silicone composition has excellent displacement resistance and excellent coatability by setting the total of the component (C) and the component (D) to 200-6,000 parts by mass relative to 100 parts by mass of the total of the component (A) and the component (B), and having an absolute viscosity at 25 DEG C of 100-800 Pa*s. The present invention also provides a method for producing this thermally conductive silicone composition.
Description
technical field [0001] The present invention relates to a thermally conductive silicone composition, and relates to a thermally conductive silicone composition excellent in coating performance and offset resistance, and a method for producing the same. Background technique [0002] In general, electric-electronic components generate heat during use, and therefore heat must be removed in order for these components to function properly, and various heat-conductive materials used in the heat removal have been proposed so far. As the thermally conductive material in this case, there are two types of thermally conductive materials: (1) a sheet-like thermally conductive material that is easy to handle, and (2) a paste-like thermally conductive material called grease for heat dissipation. [0003] The sheet-shaped thermally conductive material of (1) is not only easy to handle but also excellent in stability. On the other hand, the thermal contact resistance inevitably increases, s...
Claims
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IPC IPC(8): C08L83/14C08K3/01C08K3/22C08K3/28
CPCC08G77/20C08G77/12C08G77/18C08L83/04C09D183/04C08K2201/005C08K3/22C08L83/00C08K5/56C08K3/14C08K3/28C08G77/08C08K2003/222C08K2003/2227C08K2003/2296C08K2003/282C08K2201/001C08K2201/006C08K2201/014C09K5/14
Inventor 市六信广
Owner SHIN ETSU CHEM IND CO LTD