Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Manufacturing method and device of brain slicing mold, electronic equipment and storage medium

A production method and slicing technology, which are applied in the directions of manufacturing auxiliary devices, processing and manufacturing, processing data acquisition/processing, etc., can solve the problems of low slicing quality, and achieve the effect of improving quality and improving experimental efficiency.

Active Publication Date: 2021-01-19
PEKING UNIV SCHOOL OF STOMATOLOGY
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present disclosure is to provide a brain slice mold manufacturing method, device, electronic equipment and storage medium, at least to a certain extent to overcome the problem of low slice quality in the related art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method and device of brain slicing mold, electronic equipment and storage medium
  • Manufacturing method and device of brain slicing mold, electronic equipment and storage medium
  • Manufacturing method and device of brain slicing mold, electronic equipment and storage medium

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038]Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0039] Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus repeated descriptions thereof will be omitted. Some of the block diagrams shown in the drawings are functional entities and do not necessarily correspond to physically or logically separate entities. These functional entities m...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a manufacturing method and device of a brain slicing mold, electronic equipment and a storage medium, and relates to the field of life science devices. The method comprises thefollowing steps of receiving complete morphological data of a skull determined by an optical scanning technology, and determining an anatomical mark of the skull; aligning the complete form data witha coordinate system of a preset three-dimensional coordinate space through the anatomical mark of the skull to obtain first form data aligned with the coordinate system; receiving second form data determined by the optical scanning technology, importing the second form data into the three-dimensional coordinate space and aligning the second form data with the first form data to obtain imported third form data; generating the brain slicing mold according to the third form data; forming a cutter groove in the brain slicing mold according to a preset slicing position; and carrying out 3D printingon the brain slicing mold with the cutter groove. By means of the scheme, the groove of the brain slicing mold is more attached to brain tissue, the slicing direction is made to be consistent with the standard brain atlas slicing direction, and the slicing quality is improved.

Description

technical field [0001] The present disclosure relates to the technical field of devices used in life sciences, and in particular to a method for making a brain slice mold, a device, electronic equipment and a storage medium. Background technique [0002] Slicing the brain tissue of experimental animals is an important step in the study of brain morphology in neuroscience. At present, there are brain slice molds specially used for experimental animals such as rats and mice at home and abroad. It is usually a rectangular parallelepiped metal block, with a groove on the upper end to accommodate the animal brain tissue. Section animal brain tissue. [0003] In related technologies, although the shape of the groove of the brain slice mold is similar to that of the brain tissue sample, the matching degree and stability between the brain tissue sample and the groove are low in actual use, and it is not easy to place the brain tissue sample in the ideal position in the mold , the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B29C64/10B29C64/20B29C64/386B29C64/393B33Y10/00B33Y30/00B33Y50/00B33Y50/02
CPCB29C64/10B29C64/20B29C64/386B29C64/393B33Y10/00B33Y30/00B33Y50/00B33Y50/02
Inventor 徐啸翔曹烨谢秋菲
Owner PEKING UNIV SCHOOL OF STOMATOLOGY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com