Pressure sensor based on mechanical metamaterial structure

A technology of pressure sensors and metamaterials, applied in the direction of instruments, measuring force, measuring devices, etc., can solve the problems of low sensitivity and resolution, large volume, large measurement error, etc.

Active Publication Date: 2021-01-29
NANJING GAOHUA TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At the same time, as a necessary part of the Internet of Things, MEMS pressure sensors will also be further promoted and applied with the development of the information society. However, the current pressure sensors are large in size, low in sensitivity and resolution, and have large measurement errors. shortcoming

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  • Pressure sensor based on mechanical metamaterial structure
  • Pressure sensor based on mechanical metamaterial structure

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Embodiment Construction

[0031] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. Apparently, the described embodiments are some, not all, embodiments of the present invention. Based on the described embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0032] Such as figure 1 and figure 2 As shown, the present invention provides a pressure sensor 100 based on a mechanical metamaterial structure. The pressure sensor 100 includes: a substrate 110, a pressure sensing unit 120 disposed on the substrate 110, at least one thermal drive unit (130 / 140), A strain sensing unit, an anchor point group and a lead group, the strain sensing unit includes a mechanical met...

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Abstract

The invention provides a pressure sensor based on a mechanical metamaterial structure. The sensor comprises a substrate, a pressure sensing unit, at least one thermal driving unit, a strain sensing unit, an anchor point group and a lead group, wherein the pressure sensing unit, the at least one thermal driving unit, the strain sensing unit, the anchor point group and the lead group are arranged onthe substrate. The strain sensing unit comprises the mechanical metamaterial structure and a strain sensitive film, wherein the pressure sensing unit is electrically connected with at least one thermal driving unit through the lead group and the anchor point group to form a current path. When a current in the current path changes, the thermal driving unit can generate a single-direction strain, and the mechanical metamaterial structure is connected with each thermal driving unit to convert the single-direction strain into multi-direction strain. The strain sensitive film is electrically connected with the mechanical metamaterial structure so that the pressure is measured by detecting the resistance value according to the multi-directional strain output resistance value, and the sensitivity of the pressure sensor to the pressure is further improved.

Description

technical field [0001] The invention belongs to the technical field of pressure sensors, in particular to a pressure sensor based on a mechanical metamaterial structure. Background technique [0002] Pressure sensor is the most widely used sensor at present, and plays an irreplaceable role in various industrial automatic control environments. In the wearable electronic systems emerging in recent years, pressure detection technology runs through the frontier fields such as electronic skin, wrist pulse wave monitoring and robotic hand tactile feedback. According to the different sensing mechanisms, pressure sensors can be divided into three categories, namely piezoelectric sensors, piezocapacitive sensors and piezoresistive sensors. Under the development trend of device miniaturization, pressure sensors using MEMS technology have many advantages compared with traditional pressure sensors, such as small size, high precision, low power consumption, easy integration, and excelle...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/22
CPCG01L1/22G01L1/2287
Inventor 李维平兰之康
Owner NANJING GAOHUA TECH
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