DB small board and PCB connecting structure and method

Abstract

The invention discloses a connecting structure and method for a DB small board and a PCB, and aims to overcome the defects that after the DB small board is connected with the PCB, a golden finger of the DB small board after soldering is not tinned, and the rate of defective products is high. The connecting structure comprises the DB small board and the PCB, the edge of the DB small board is provided with a connecting part extending outwards and protruding, the PCB body is provided with an inserting groove correspondingly matched with the connecting part, the connecting part is provided with aplurality of golden finger bonding pads arranged at intervals, one end of each golden finger bonding pad is provided with a through hole, and a gap is formed between the other end of each golden finger bonding pad and the edge of the connecting part. A plurality of soldering lugs are arranged on the edge of the inserting groove in the PCB and the golden finger bonding pads in a one-to-one correspondence mode, the connecting part is inserted into the inserting groove, the golden finger bonding pads are exposed out of the lower surface of the PCB, the through holes are hidden in the inserting groove, and the golden finger bonding pads and the soldering lugs are correspondingly welded. The DB small board is reliably connected with the PCB, and the golden finger of the DB small board after soldering is fully tinned, so that defective products are avoided.

Description

technical field [0001] The invention relates to a connection structure of a circuit board, more specifically, it relates to a connection structure and method of a DB small board and a PCB board. Background technique [0002] In recent years, LED driver lamps are gradually replacing the original traditional fluorescent tubes with their energy saving, environmental protection, beautiful and exquisite features, and gradually occupy most of the home lighting and develop towards intelligent lighting. Among them, due to the rapid increase of intelligent functions, and the range of drive size compared with the previous ones, not only has it not increased, but it is gradually decreasing. In response to market demand, it is derived to insert a small DB board on the product to solve the traditional layout method that the patch can only be pasted on the bottom and front of the driver. Now the commonly used DB small board, the gold finger copper foil on it is directly spread to the edg...

AI Technical Summary

Problems solved by technology

Now the commonly used DB small board, the gold finger copper foil on it is directly spread to the edge of the board, the through hole on the gold finger is inserted into the PCB board and exposed, the gold finger of the DB small board after the furnace is not tinned, and the defect rate reaches 100%. To solve this problem, it is necessary to add workers after the furnace to add tin 100%. However, due to the high defect rate, some defective products still leak and flow out

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