Composite material and manufacturing method thereof, and electronic device
A composite material and manufacturing method technology, used in electronic equipment, chemical instruments and methods, thin material processing and other directions, can solve the problems of insufficient strength of thermoplastic materials, inability to meet product strength and light weight, and high cost of carbon fiber, and achieve excellent mechanical strength. Effect
Pending Publication Date: 2021-02-02
COMPAL ELECTRONICS INC
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- Claims
- Application Information
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Problems solved by technology
In recent years, with the rising awareness of environmental protection, electronic devices have abandoned thermosetting materials that are not easy to recycle, and tend to use thermoplastic materials or relatively new materials such as glass fiber and carbon fiber as the casing, but the strength of thermoplastic materials is obviously insufficient, while carbon fiber The cost is too high, and it cannot meet the strength and lightweight requirements of the product
Method used
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[0037]The foregoing and other technical content, features, and effects of this application will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. Directional terms mentioned in the following embodiments, for example: up, down, left, right, front or back, etc., are only the directions with reference to the drawings. Therefore, the directional terms used are used to illustrate but not to limit this application.
[0038]figure 1 It is a schematic cross-sectional view of a composite material in a first state according to an embodiment of the present application.
[0039]Please refer tofigure 1 The composite material 100 includes a core layer 110, a first thermoplastic adhesive layer 120, and a second thermoplastic adhesive layer 130. The core layer 110 has a first surface S1 and a second surface S2 opposite to each other. The first surface S1 of the core layer 110 is attached to the first thermoplastic adhesive la...
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Abstract
The present disclosure provides a composite material including a first thermoplastic adhesive layer made of a first thermoplastic resin, a second thermoplastic adhesive layer made of a second thermoplastic resin, and a core layer. The core layer has a first surface and a second surface, wherein the first surface is bonded to the first thermoplastic adhesive layer, and the second surface is bondedto the second thermoplastic adhesive layer. The core layer has a plurality of cavities, wherein each of the plurality of cavities has a pore diameter smaller than a thickness of the core layer. The first thermoplastic resin and the second thermoplastic resin are respectively adapted to be filled in a part of the plurality of cavities adjacent to the first surface of the core layer and a part of the plurality of cavities adjacent to the second surface of the core layer by heating.
Description
Technical field[0001]This application relates to a composite material and its manufacturing method, and in particular to a composite material and its manufacturing method suitable for electronic devices.Background technique[0002]In recent years, electronic devices have become indispensable and important products in human life. With the advancement of technology, the functions and speed of electronic devices have been continuously strengthened. From the early large-scale machinery to desktop computers, notebook computers, tablet computers, smart phones, personal digital assistants, and e-books, etc. All kinds of portable electronic devices.[0003]The two key requirements of electronic devices are volume reduction and weight reduction. In addition to the development of microelectronic components in electronic devices in this direction, the selection of housing materials for electronic devices is also the focus of current development. In recent years, with the rising awareness of enviro...
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IPC IPC(8): B32B3/24B32B7/12B32B5/18B32B3/08B32B9/00B32B27/04B32B27/28B32B9/04B32B27/12B29C65/48B29L9/00
CPCB32B3/266B32B7/12B32B5/18B32B3/08B32B5/02B32B5/245B29C65/48B29C66/45B32B2266/0214B32B2260/021B32B2260/046B32B2262/106B32B2307/718B29L2009/00B32B27/08B32B2266/0235B32B5/024B32B2266/0228B32B2266/0242B32B2262/0246B32B2457/00B32B2307/732B32B2307/72B32B2266/025B32B2266/08B32B2262/0276B32B2262/0269B32B19/047B32B2262/10B32B2262/0253B32B2266/0278B32B2262/101B32B7/027B32B7/022B32B2260/023B32B27/16B32B27/12Y10T428/13Y10T428/1376Y10T428/1352
Inventor 黄寒青吴荣钦凌国南林伯安
Owner COMPAL ELECTRONICS INC