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Preparation method of heat-conducting wave-absorbing phase-change composite material, and composite material

A technology of phase-change composite materials and wave-absorbing fillers, which can be applied to heat exchange materials, chemical instruments and methods, etc., and can solve the problems of easy rupture of phase-change microcapsules.

Pending Publication Date: 2021-02-02
SHENZHEN HFC SHIELDING PRODS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the problem that the phase-change microcapsules are easy to break when they are made, the application provides a method for preparing a heat-conducting and wave-absorbing phase-change composite material and the composite material

Method used

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  • Preparation method of heat-conducting wave-absorbing phase-change composite material, and composite material
  • Preparation method of heat-conducting wave-absorbing phase-change composite material, and composite material
  • Preparation method of heat-conducting wave-absorbing phase-change composite material, and composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] A preparation method of heat-conducting wave-absorbing phase-change composite material, such as figure 1 As shown, the following preparation steps are included: S1 premixing: add 10 parts of PCL to the stainless steel cup with heating device in the premixing container, add 30 parts of liquid polyisobutylene and 25 parts of phase change microcapsules in turn after melting, and stir well To obtain a uniformly dispersed phase-change premixed substrate, the heating temperature of the heating device is set to 100°C;

[0041] S2 Filler mixing: Add 400 parts of wave-absorbing fillers, 1000 parts of thermally conductive fillers, 3 parts of coupling agents, and 2 parts of antioxidants to the phase change premixed substrate and stir. The heating temperature during stirring is set to 100 ° C. The above components Disperse and mix evenly and then vacuumize and defoam to obtain semi-finished products;

[0042] S3 Calendering: Set the temperature of the rollers of the calender to 80...

Embodiment 2

[0055] This embodiment is provided with 4 groups of experimental groups and 2 groups of control groups. Compared with embodiment 1, the only difference is that the temperature of the calender roller in step S3 in experimental group A is set to 70°C; in experimental group B, step S3 The temperature of the calender roll in the experimental group C is set to 75°C; the temperature of the calender roll in step S3 in the experimental group C is set to 85°C; the temperature of the calender roll in step S3 in the experimental group D is set to 90°C; the control group The temperature of the calender roll in step S3 in A was set to 60°C; the temperature of the calender roll in step S3 in control group B was set to 100°C.

[0056] The composite materials obtained in each group in Example 2 were tested, and the test data are shown in Table 3.

[0057] Table 3: composite material test data in embodiment 2

[0058]

[0059] Combining the data of Example 1 and Example 2 and Table 3, it c...

Embodiment 3

[0061] This embodiment is provided with 4 groups of experimental groups and 2 groups of control groups. Compared with Example 1, the only difference is that the PCL added in step S1 in the experimental group A is 6.5 parts, the liquid polyisobutylene is 32 parts, and the phase change microcapsules 26.5 parts; the PCL that step S1 added in the experimental group B was 8 parts, the liquid polyisobutylene was 31 parts, and the phase change microcapsules were 26 parts; the PCL that step S1 added in the experimental group C was 12 parts, and the liquid polyisobutylene was 29 parts 1, 24 parts of phase-change microcapsules; 13 parts of PCL, 28 parts of liquid polyisobutylene, and 24 parts of phase-change microcapsules in step S1 in the experimental group D; 3 parts of PCL added in step S1 in control group A , 34 parts of liquid polyisobutylene, and 28 parts of phase-change microcapsules; 20 parts of PCL, 25 parts of liquid polyisobutylene, and 20 parts of phase-change microcapsules w...

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Abstract

The invention relates to the field of application of electronic functional materials, and particularly discloses a preparation method of a heat-conducting wave-absorbing phase-change composite material, and the composite material. The preparation method of the heat-conducting wave-absorbing phase-change composite material comprises the following steps: S1, premixing: adding thermoplastic resin with a first melting point into a premixing container provided with a heating device, and sequentially adding thermoplastic resin with a second melting point and a phase-change microcapsule after melting; S2, filler mixing: adding a wave-absorbing filler, a heat-conducting filler and an auxiliary agent into a phase-change premixed base material obtained in the step S1, and conducting uniform stirringand dispersing to obtain a semi-finished product; and S3, calendering: calendering the semi-finished product at a calendering temperature to a required thickness, and conducting cooling to obtain theheat-conducting wave-absorbing phase-change composite material. Due to the fact that the calendering temperature corresponds to the first melting point of the thermoplastic resin with the first melting point, and the second melting point of the thermoplastic resin with the second melting point is lower than the first melting point of the thermoplastic resin with the first melting point by 20 DEGC or more and lower than the calendering temperature by 10 DEG C or more, so the effect of avoiding cracking of the shell structure of the phase-change microcapsule during calendering is achieved.

Description

technical field [0001] This application relates to the application field of electronic functional materials, and more specifically, it relates to a preparation method of a heat-conducting wave-absorbing phase-change composite material and the composite material. Background technique [0002] With the continuous upgrading and development of electronic technology, the size of electronic components represented by semiconductor components is getting smaller and more integrated functions. As the integration of electronic products becomes higher and higher, the heat generation becomes exponential At the same time, the problem of electromagnetic interference accompanying integration is becoming more and more serious. When electromagnetic waves encounter metal materials, they will be reflected to form more cluttered electromagnetic waves, further exacerbating the electromagnetic interference problem inside the product. For this reason, the common method to solve electromagnetic int...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/20C08L67/02C08K13/06C08K9/10C08K3/04C08K7/18C08K7/00C08K3/18C08K3/22C08K3/28C09K5/06
CPCC08L23/22C09K5/066C09K5/063C08K2003/282C08K2003/2227C08K2201/01C08L67/02C08K13/06C08K9/10C08K3/04C08K7/18C08K7/00C08K3/18C08K3/22C08K3/28
Inventor 羊尚强曹勇谢佑南陈印文渊平
Owner SHENZHEN HFC SHIELDING PRODS CO LTD
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