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A kind of electroless palladium plating liquid and its application, the method for electroless palladium plating

A technology of chemical plating and tetrammine palladium sulfate is applied in liquid chemical plating, metal material coating process, coating and other directions, and can solve problems such as increased process cost and waste of precious metal palladium.

Active Publication Date: 2021-09-10
吉安宏达秋科技有限公司 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This results in a waste of precious metal palladium, greatly increasing the cost of the process

Method used

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  • A kind of electroless palladium plating liquid and its application, the method for electroless palladium plating
  • A kind of electroless palladium plating liquid and its application, the method for electroless palladium plating
  • A kind of electroless palladium plating liquid and its application, the method for electroless palladium plating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] Dissolve polyethyleneimine in deionized water to obtain a concentrated solution of polyethyleneimine with a concentration of 100 mg / L;

[0072] 1g tetraammine palladium sulfate, 5g ethylenediamine, 7.5g 2-amino-n-butanol, 7.5g isobutanolamine, 10g methacrylic acid, 10g crotonic acid, 10mL polyethyleneimine with a mass concentration of 100mg / L The concentrated solution, 5g of sodium hypophosphite and 0.5L of deionized water were mixed and stirred to dissolve to obtain a primary mixed solution;

[0073] The primary mixed solution and 0.5L deionized water were mixed and stirred to dissolve to obtain an electroless palladium plating solution; the pH value of the electroless palladium plating solution was adjusted to be 7;

[0074] The printed circuit board is pretreated according to the following steps: the first pickling (100mL / LHDQ-201 acidic detergent solution, 5min) → the first water washing (deionized water, soaking for 30s) → microetching (in the mixed solution Sodiu...

Embodiment 2

[0079] Dissolve polyethyleneimine in deionized water to obtain a concentrated solution of polyethyleneimine with a concentration of 100 mg / L;

[0080] 1g tetraammine palladium sulfate, 3g ethylenediamine, 75g 2-amino-n-butanol, 10g isobutanolamine, 8g methacrylic acid, 12g crotonic acid, 50mL concentration of polyethyleneimine concentrated solution of 100mg / L, 5g of sodium hypophosphite and 0.5L of deionized water were mixed and dissolved with stirring to obtain a primary mixed solution;

[0081] The primary mixed solution and 0.5L deionized water were mixed, stirred and dissolved to obtain an electroless palladium plating solution; the pH value of the electroless palladium plating solution was adjusted to 7.

[0082] The electroless plating layer was prepared according to the method of Example 1, except that the electroless palladium plating solution prepared in Example 2 was used.

Embodiment 3

[0084] Dissolve polyethyleneimine in deionized water to obtain a concentrated solution of polyethyleneimine with a concentration of 100 mg / L;

[0085] 1g tetraammine palladium sulfate, 6g ethylenediamine, 7g 2-amino-n-butanol, 7g isobutanolamine, 8g methacrylic acid, 12g crotonic acid, 50mL concentration of polyethyleneimine concentrated solution of 100mg / L, 5g of sodium hypophosphite and 0.5L of deionized water were mixed and dissolved with stirring to obtain a primary mixed solution;

[0086] The primary mixed solution and 0.5L deionized water were mixed, stirred and dissolved to obtain an electroless palladium plating solution; the pH value of the electroless palladium plating solution was adjusted to 7.

[0087] The electroless plating layer was prepared according to the method of Example 1, except that the electroless palladium plating solution prepared in Example 3 was used.

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Abstract

The invention belongs to the technical field of surface treatment of circuit boards, and in particular relates to an electroless palladium plating liquid, an application thereof, and a method for electroless palladium plating. The invention provides an electroless palladium plating solution, which uses water as a solvent and includes solutes with the following mass concentrations: 1-10 g / L tetraammonia palladium sulfate, 1-20 g / L sodium hypophosphite, 10-30 g / L complex complex agent, 10~30g / L composite stabilizer; the composite complexing agent includes ethylenediamine, 2-amino n-butanol and isobutanolamine, and the composite stabilizer includes methacrylic acid, crotonic acid and polyethylene amine. The electroless palladium plating solution provided by the invention has strong activity, and the palladium coating with excellent performance can be obtained without activation by dragging a cylinder. As can be seen from the results of the examples, the electroless palladium plating solution provided by the invention has good stability and longer service life; the palladium plating layer obtained by utilizing the electroless palladium plating solution provided by the invention to carry out electroless palladium plating has good corrosion resistance and bonding performance.

Description

technical field [0001] The invention belongs to the technical field of surface treatment of circuit boards, and in particular relates to an electroless palladium plating liquid, an application thereof, and a method for electroless palladium plating. Background technique [0002] A printed circuit board (Print Circuit Board, PCB) is a substrate for assembling electronic components, and is a printed board that forms point-to-point connections and printed components on a general-purpose substrate according to a predetermined design. In order to ensure the solderability of the circuit board in subsequent assembly and use, it is necessary to treat the surface of the circuit. [0003] The currently commonly used surface technology is the electroless nickel immersion gold process, that is, a nickel layer is first deposited on the copper surface of the circuit board, and then a gold layer is plated on the nickel layer through a displacement reaction. Although the electroless nickel...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/44
CPCC23C18/44
Inventor 文明立彭小英杨义华赵超刘光明
Owner 吉安宏达秋科技有限公司
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