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System and method for thermal management of reticle in semiconductor manufacturing

A reticle and semiconductor technology, applied in the field of semiconductor systems, can solve the problems of pattern transfer accuracy and adverse effects of process yield

Inactive Publication Date: 2021-02-02
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During fabrication, overlay caused by reticle heating can adversely affect pattern transfer accuracy and process yield

Method used

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  • System and method for thermal management of reticle in semiconductor manufacturing
  • System and method for thermal management of reticle in semiconductor manufacturing
  • System and method for thermal management of reticle in semiconductor manufacturing

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Embodiment Construction

[0020] The following disclosure provides many different embodiments, or examples, of different artifacts for implementing the presented subject matter. Specific examples of components and arrangements are set forth below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, the following description of forming a first workpiece on or onto a second workpiece may include embodiments in which the first and second workpieces are formed in direct contact, as well as embodiments in which the first and second workpieces are formed in direct contact with each other. An embodiment in which an additional workpiece may be formed between the second workpieces such that the first workpiece and the second workpiece may not be in direct contact. Additionally, this disclosure may reuse reference numbers and / or letters in various instances. Such re-use is for brevity and clarity and does not itself indicate a relationship bet...

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PUM

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Abstract

A method for thermal management of reticles for conducting an exposure process includes operations. A default state of a reticle is selected based on given data, where the given data includes overlayvalues of a plurality of processed semiconductor workpieces and temperature profiles of the reticle correlated to the processed semiconductor workpieces. The reticle is regulated to reach the defaultstate before using the reticle to perform the exposure process.

Description

technical field [0001] Embodiments of the present invention relate to a semiconductor system and method, and in particular to a system and method for thermally managing a reticle used in an exposure process. Background technique [0002] As semiconductor devices are scaled down, the complexity of manufacturing integrated circuits (ICs) increases. For example, the need to perform higher resolution photolithography processes has grown. A reticle (or photomask) used in a photolithography process has a circuit pattern formed thereon and is transferred onto a semiconductor wafer. During fabrication, overlay caused by reticle heating may adversely affect pattern transfer accuracy and process yield. Thus, while existing technologies are adequate for their intended purposes, they are not satisfactory in all respects. Contents of the invention [0003] According to some embodiments, a method of thermally managing a reticle for performing an exposure process includes at least the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20G03F1/48
CPCG03F7/70875G03F7/70741G03F7/70733G03F7/70491G03F1/48G03F7/70633G03F7/705G03F7/70891
Inventor 杨岳霖廖启宏
Owner TAIWAN SEMICON MFG CO LTD