Integrated cleaning, drying and conveying device for chip production

Abstract

The invention discloses an integrated cleaning, drying and conveying device for chip production. The integrated cleaning, drying and conveying device comprises a cleaning box, a spraying box, a cold air box, a drying box and a conveying line which are sequentially arranged from left to right, wherein a cleaning mechanism is mounted at the top end of the cleaning box; a driving mechanism is arranged on the back side of the cleaning box; a chip storing mechanism is mounted on the driving mechanism; water pipes are mounted on the front face and the back face of the spraying box at equal intervals; inclined pipes are welded to the water pipes at equal intervals; and spraying heads are mounted at the tail ends of the inclined pipes. The integrated cleaning, drying and conveying device is provided with the cleaning mechanism, and compared with a traditional device, the cleaning quality is better; the chip storing mechanism is arranged and is arranged to be a chip storing plate capable of being taken out, thus chips on the chip storing plate are sprayed and dried in all directions, and the problems that in the traditional mode, the chips are stored on the conveying line, consequently, thedrying effect of one face is poor, and watermarks exist are solved; and a correcting mechanism is arranged, the center distance of the chips is conveniently corrected, and thus the integrated cleaning, drying and conveying device can be well connected with the next technological process.

Description

technical field [0001] The invention relates to an integrated cleaning, drying, and conveying equipment for chip production, in particular to an integrated cleaning, drying, and conveying equipment for chip production, and belongs to the application technical field of chip cleaning equipment. Background technique [0002] An integrated circuit (Integrated Circuit, referred to as IC), also known as a chip (chip), as the name implies, is to integrate a certain number of commonly used electronic components, such as resistors, capacitors, transistors, etc., and the connections between these components through semiconductor technology. circuits with specific functions. [0003] The traditional chip cleaning method is to use deionized water to rinse the chip. Although this washing method can also rinse off the dirt on the surface of the chip, the cleaning effect is not good enough. In addition, cold air is needed to blow off the water droplets on the surface and then dry with hot ...

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Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the traditional chip cleaning method is to use deionized water to rinse the chip. Although this washing method can also rinse off the dirt on the surface of the chip, the cleaning effect is not good enough. The beads are blown off and then dried with hot air. The traditional method is to dry them directly on the conveyor line. Because one side is facing the conveyor line, the drying effect on that side is not good, and there may be watermarks. Finally, when the chips are dried and discharged due to There is no positioning and correcting mechanism, the output material is scattered, and it cannot be closely connected with the next process flow, so an integrated cleaning and drying conveying equipment for chip production is proposed

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