Stress distribution measuring device and method based on ultrasonic side waves

Abstract

The invention provides a stress distribution measuring device and method based on ultrasonic side waves and belongs to the field of nondestructive testing. A lifting platform in the device fixes and lifts a measured assembly to a designated position; the motion control module can realize accurate positioning of the angle-adjustable probe and accurate control of scanning motion; the transmitting orreceiving angle of the angle-adjustable probe is adjusted according to the calculated first critical angle; X-direction and Y-direction scanning step lengths are set, and the angle-adjustable probe is driven to perform X-direction and Y-direction scanning by the motion control module till measurement of the whole contact interface is completed; in the measurement process, an ultrasonic side wavesignal measured by the angle-adjustable probe is transmitted to the PC through the control loop; and the stress distribution of the contact interface is obtained according to the relationship betweenthe ultrasonic side wave signal and the contact stress. According to the method, measurement of contact interface stress distribution of assemblies with different structures can be realized, measurement precision is high, the universality is good, the automation degree is high, and the method can be applied to measurement of large-batch and complex-structure assemblies.

Description

technical field [0001] The invention relates to a stress distribution measurement device and method based on ultrasonic side waves, belonging to the field of nondestructive testing. Background technique [0002] All parts in mechanical equipment are connected through contact interfaces to ensure the relative position, function and information transmission of each other. Therefore, the performance of mechanical systems is inevitably limited by the interfacial contact behavior. With the advancement of science and technology, mechanical equipment is developing in the direction of high speed, heavy load, high precision and intelligence, and equipment working in special environments is also emerging. The control of the mechanical properties of the contact interface has become a key scientific issue that limits the development of mechanical devices. As one of the important characteristics of contact interface, contact stress has become the focus of research. However, the curren...

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Problems solved by technology

[0003] The purpose of the present invention is to provide a stress distribution measurement device and method based on ultrasonic side waves in order to solve the problem that the stress distribution of the contact interface of complex structural components is difficult to measure, which overcomes the defects of the prior art and can realize the measurement of stress distribution of complex structural components , to improve the reliability of mechanical system performance evaluation

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