Leveling, collimating and feeding device for lead frame
A lead frame and leveling technology, which is applied in the direction of transportation and packaging, electrical components, electric solid devices, etc., can solve the problems of copper sheet lack of conveying and calibration flow-through operation mode, and can not be well adapted to copper sheets of different widths, etc. , to achieve the effects of stable structure, strong practicability and simplified mechanism
Active Publication Date: 2021-02-12
四川富美达微电子有限公司
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Problems solved by technology
At present, for the slit copper coils, there is no effective conveying and calibrating flow-through operation method for the conveying of copper sheets, and the conveying guide cannot be well adapted to the situation of copper sheets of different widths, so it is necessary to improve
Method used
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[0030] Such as Figure 1~Figure 6 As shown, a lead frame leveling, alignment and feeding device provided in this example includes: a plurality of conveying mechanisms 1 arranged at uniform intervals, and supporting mechanisms 2 arranged between adjacent conveying mechanisms 1 .
[0031] The conveying mechanism 1 includes a pair of lower rollers 11 and upper rollers 12 arranged at intervals, and the rotation directions of the lower rollers 11 and the upper rollers 12 are opposite. Two adjacent conveying mechanisms 1 transmit power between the two lower rollers 11 through the lower crawler belt 111, the rotation shaft of one of the lower rollers 11 is connected to the lower roller motor 112, and the power is transmitted between the two upper rollers 12 through the upper crawler belt 121. The rotation shaft of one of the upper rollers 12 is connected with an upper roller motor 122, and the lower roller motor 112 and the upper roller motor 122 rotate in opposite directions. The l...
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The invention discloses a leveling, collimating and feeding device for a lead frame. The device comprises a plurality of conveying mechanisms which are evenly arranged at intervals and supporting mechanisms arranged between the adjacent conveying mechanisms. Each conveying mechanism comprises a lower roller and an upper roller which are arranged in pairs at an interval; the supporting mechanism comprises a fixed supporting table and a movable supporting table, a movable rod and a guide rod are arranged on the bottom surface of the movable supporting table, a pair of guide channels are formed in the fixed supporting table in a penetrating mode, the guide rods are in sliding fit with the guide channels, and an adjusting gear is rotationally arranged on the bottom surface of the fixed supporting table and connected with an output shaft of an adjusting motor; a tooth portion is arranged on one side face of the movable rod, the movable rod at two sides of the movable supporting table passesthrough the tooth portion to be meshed with two sides of the tooth portion, the fixed supporting table is provided with a guide limiting block, and the movable supporting table is provided with at least one guide roller. Copper sheet conveying is carried out on a slit copper foil coil, assembly line type leveling collimation is achieved, feeding is carried out on the stamping die after leveling,adaptive adjustment can be carried out according to the width and thickness of a copper sheet, and the practicability is high.
Description
technical field [0001] The invention relates to the field of semiconductor components, in particular to a lead frame, in particular to a lead frame leveling, alignment and feeding device. Background technique [0002] Lead frame is an important carrier of semiconductor devices and integrated circuit modules. In the preparation of this type of device / module, the required wafer / chip is usually fixed on the designated area of the lead frame by means of bonding, etc., and electrical conduction is achieved by bonding gold wires or setting jumpers, and then packaged. Plastic base, and corresponding cutting, punching, folding, etc. to obtain products. [0003] In the preparation of the lead frame, it is necessary to use a mold to perform stamping or pressing of different shapes on the designated areas of the lead frame, so as to obtain the finished lead frame. The raw material used to prepare the lead frame is a copper coil. The copper coil is used as a raw material after being...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L21/677H01L23/495H01L21/48
CPCH01L21/4821H01L21/4839H01L21/67706H01L23/495
Inventor 曾尚文陈久元杨利明刘高宸
Owner 四川富美达微电子有限公司