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Method for producing a high-temperature-resistant lead-free solder joint, and high-temperature-resistant lead-free solder joint

A lead-free solder joint, high temperature resistant technology, used in manufacturing tools, printed circuit manufacturing, soldering/welding/cutting items, etc., can solve problems such as unfavorable industrial production lines, long soldering time, etc., to save production time and shorten soldering time. , the effect of reducing thermal stress

Active Publication Date: 2021-02-12
EHNDRESS KHAUZER GMBKH KO KG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since diffusion welding in principle requires very long welding times (e.g. up to 30 minutes i

Method used

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  • Method for producing a high-temperature-resistant lead-free solder joint, and high-temperature-resistant lead-free solder joint
  • Method for producing a high-temperature-resistant lead-free solder joint, and high-temperature-resistant lead-free solder joint
  • Method for producing a high-temperature-resistant lead-free solder joint, and high-temperature-resistant lead-free solder joint

Examples

Experimental program
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Embodiment Construction

[0057] Figure 1a to Figure 1c The steps of the method according to the invention in an embodiment of a part of a printed circuit board 1 and the solder joints 7 obtained by the method are shown in cross-section. In order to enhance the illustration, the solder preform 3 is shown here in a significantly enlarged manner.

[0058] Figure 1a A solder preform 3 made of composite PFDS400 is shown, in which the tin-containing solder alloy used as the first composite part VK1 is embedded in a substantially layered manner in the copper matrix forming the second composite part VK2. The solder preform 3 is applied to the solderable surface 11 of the printed circuit board 1 , here designed as a contact surface 10 , such that the layers of the first composite part VK1 are arranged essentially parallel to the solderable surface 11 . The layer comprising the tin-containing solder alloy is shown here in dashed form.

[0059] In this embodiment, the solder pre-form 3 is applied to the sold...

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Abstract

The invention relates to a method for producing a high-temperature-resistant lead-free solder joint (7; 71) between a circuit board (1) and a part (2; 2b), wherein a lead-free solder preform (3; 3b) is used that has a composite material having a first composite component (VK1) arranged substantially in layers; and wherein the part (2; 2b) is soldered with the solder preform (3; 3b) in a hot-bar selective soldering process. The invention also relates to a high-temperature-resistant lead-free solder joint (7; 71) and to a field device (8) of automation technology for determining and/or monitoring the process variable of a medium with a high-temperature-resistant solder joint (7; 71).

Description

technical field [0001] The present invention relates to a method for creating high temperature resistant lead-free solder joints between printed circuit boards and components. The invention also relates to high-temperature-resistant lead-free solder joints and field equipment with high-temperature-resistant lead-free solder joints. Background technique [0002] Soldering is the thermal process of obtaining an integral joint by melting solder (fusion welding) or by diffusion at the interface (diffusion welding). In various embodiments, printed circuit boards on which components are soldered are used in automation technology field devices produced and sold by the Endress+Hauser group. In principle, within the scope of this application, all measuring devices for determining and / or monitoring process variables which are used for accessing the process and supplying or process-related information are referred to as field devices. These are, for example, fill level measuring devi...

Claims

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Application Information

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IPC IPC(8): B23K1/00B23K35/30B23K101/38B23K101/36B23K35/02B23K35/26
CPCB23K1/0016B23K35/0238B23K35/262B23K35/302B23K35/0244B23K2101/36H05K1/181H05K3/3478H05K3/3494
Inventor 埃尔克·施密特迪特马尔·比格尔
Owner EHNDRESS KHAUZER GMBKH KO KG