A Wafer Glue Spraying Mechanism Based on Chip Processing
A technology of wafer and glue spraying, which is applied in the direction of photomechanical equipment, pattern surface photolithography process, photoplate process coating equipment, etc., can solve the problems of equipment pollution, wafer processing quality impact, etc., and increase the use performance , increase the effect of wiping effect
Active Publication Date: 2021-12-10
芯钛科半导体设备(上海)有限公司
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Problems solved by technology
[0002] A wafer is a silicon wafer for making silicon semiconductor integrated circuits. When the wafer is being processed, a layer of photoresist needs to be evenly sprayed on the surface of the wafer. Generally, the photoresist is dropped on the surface of the wafer through glue spraying equipment. Then the wafer is rotated by the external equipment, and under the action of the centrifugal force generated by the rotation and the surface tension of the photoresist, a photoresist film with uniform thickness is formed on the surface of the wafer. However, during the process of rotating the photoresist, Because the photoresist will flow, the photoresist will diffuse to the outside of the wafer, causing part of the photoresist to flow out from the wafer surface and fall on the equipment, causing pollution to the equipment, and the photoresist will flow out during the outflow process. Part of the photoresist is in contact with the sidewall of the wafer, causing part of the photoresist to stay on the sidewall of the wafer and solidify, which affects the quality of wafer processing. Therefore, we propose a wafer processing based on chip processing. Round glue spraying mechanism
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[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0019] The present invention provides a technical solution: a wafer glue spraying mechanism based on chip processing, please refer to figure 1 , including workbench 1;
[0020] see figure 1 , the outer wall on the right side of the top of the workbench 1 is fixedly installed with a frame 2, the inner wall on the top of the frame 2 is provided with a hydraulic cylinder, and the hydraulic rod at the bottom of the hydraulic cylinder is fixedly connected to the n...
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The invention discloses a wafer glue spraying mechanism based on chip processing in the technical field of chip processing, including a workbench, a frame is fixedly installed on the right outer wall of the top of the workbench, and a hydraulic cylinder is arranged on the inner wall of the top of the frame. And the hydraulic rod at the bottom of the hydraulic cylinder is fixedly connected to the nozzle, the left outer wall on the top of the workbench is connected to the rotating pipe in rotation, the bottom end of the rotating pipe is fixedly connected to the air pump through the pipe, and the rotating pipe is connected to the pipe in rotation, and the support platform The outer wall is sleeved with a shielding device. In the device, the outside of the support table is covered by a shielding cover, so that the photoresist will not fall on the workbench due to rotation, and the surroundings of the equipment are protected, and the excess photoresist is collected by the collection tank. Collect to avoid photoresist accumulation on the top wall edge of the wafer and cause uneven photoresist smear.
Description
technical field [0001] The invention relates to the technical field of chip processing, in particular to a wafer glue spraying mechanism based on chip processing. Background technique [0002] A wafer is a silicon wafer for making silicon semiconductor integrated circuits. When the wafer is being processed, a layer of photoresist needs to be evenly sprayed on the surface of the wafer. Generally, the photoresist is dropped on the surface of the wafer through glue spraying equipment. Then the wafer is rotated by the external equipment, and under the action of the centrifugal force generated by the rotation and the surface tension of the photoresist, a photoresist film with uniform thickness is formed on the surface of the wafer. However, during the process of rotating the photoresist, Because the photoresist will flow, the photoresist will diffuse to the outside of the wafer, causing part of the photoresist to flow out from the wafer surface and fall on the equipment, causing ...
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IPC IPC(8): B05C5/00B05C11/08B05C11/10B05C15/00B05C13/02G03F7/16
CPCB05C5/002B05C11/08B05C11/1039B05C15/00B05C13/02G03F7/162
Inventor 巩铁凡
Owner 芯钛科半导体设备(上海)有限公司