Target welding and cooling integrated device and operation method thereof

An operation method and target technology, applied in auxiliary devices, welding equipment, manufacturing tools, etc., can solve the problems of difficult transfer, difficult to form a stable and uniform solder layer, etc., to reduce costs, avoid abnormal welding surfaces, and reduce safety. hidden effect

Inactive Publication Date: 2021-03-02
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this method, the welding and cooling of the target and the back plate are transferred to the bracket, and only heating is carried out on the welding platform, but the transfer of the target material with solder and the back plate after heating is difficult, and it is not easy to form a stable and uniform solder layer, and does not involve the subsequent cooling process

Method used

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  • Target welding and cooling integrated device and operation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] This embodiment provides an integrated device for target welding and cooling. The structure diagram of the integrated device is as follows: figure 1 As shown, it includes a welding platform 1 and a cooling platform 2, and the welding platform 1 and the cooling platform 2 are located on the same plane; the welding platform 1 is provided with a movable heating plate 3, and the lower part of the movable heating plate 3 is connected with a transmission Assembly 4, the transmission assembly includes a transmission assembly 41 that moves up and down and a transmission assembly 42 that moves horizontally; a pressurizing assembly is provided above the cooling platform 2 .

[0069] There are two welding platforms 1 , and the cooling platform 2 is located between the two welding platforms 1 .

[0070] Each of the welding platforms 1 is provided with a movable heating plate 3 ; each of the welding platforms 1 corresponds to a group of transmission assemblies 4 .

[0071] The mate...

Embodiment 2

[0079] This embodiment provides an integrated device for target welding and cooling, the integrated device includes a welding platform 1 and a cooling platform 2, and the welding platform 1 and the cooling platform 2 are located on the same plane; A movable heating plate 3 is provided, and a transmission assembly 4 is connected below the movable heating plate 3, and the transmission assembly includes a transmission assembly 41 that moves up and down and a transmission assembly 42 that moves horizontally; components.

[0080] There are two welding platforms 1 , and the cooling platform 2 is located between the two welding platforms 1 .

[0081] Each of the welding platforms 1 is provided with a movable heating plate 3 ; each of the welding platforms 1 corresponds to a group of transmission assemblies 4 .

[0082] The material of the moving heating plate 3 is 316 stainless steel.

[0083] The movable heating plate 3 is provided with a target material and a back plate whose wel...

Embodiment 3

[0090] This embodiment provides an integrated device for target welding and cooling, the integrated device includes a welding platform 1 and a cooling platform 2, and the welding platform 1 and the cooling platform 2 are located on the same plane; A movable heating plate 3 is provided, and a transmission assembly 4 is connected below the movable heating plate 3, and the transmission assembly includes a transmission assembly 41 that moves up and down and a transmission assembly 42 that moves horizontally; components.

[0091] The welding platform 1 is provided with one.

[0092] The material of the moving heating plate 3 is 310 stainless steel.

[0093] The movable heating plate 3 is provided with a target material and a back plate whose welding surfaces are attached together, and the back plate is located under the target material and is in direct contact with the movable heating plate 3 .

[0094] The material of the target is copper, and the material of the back plate is a...

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Abstract

The invention provides a target welding and cooling integrated device and an operation method thereof. The integrated device comprises a welding platform and a cooling platform, wherein the welding platform and the cooling platform are located on the same plane, a movable heating plate is arranged on the welding platform, and a transmission assembly is connected to the lower portion of the movableheating plate. The transmission assembly comprises a vertically-moving transmission assembly body and a horizontally-moving transmission assembly body. A pressurizing assembly is arranged above the cooling platform. According to the integrated device, the welding platform and the cooling platform are integrated in the same device, welding heating, automatic carrying and pressurizing cooling of atarget assembly can be integrally achieved, manual carrying is omitted, abnormal welding faces caused by vibration possibly occurring in the manual carrying process are avoided, the welding combination rate is high, and the potential safety hazard in the carrying process is reduced; and the device can automatically operate, welding and cooling of the target assembly can be rapidly achieved, time is saved, and cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of target material preparation, and relates to a target material welding and cooling integrated device and an operation method thereof. Background technique [0002] The target is a sputtering source used for sputtering coating. Before using the target for sputtering coating, the target needs to be fixed to the backing plate to form a target assembly, and the backing plate can be fixedly installed on the sputtering base to support the target and conduct heat. The target and the backplane are usually fixed by welding. The target and the backplane are placed on the welding platform, and solder is applied to the welding surfaces of the two, and the target and the backplane are heated through the welding platform until the solder melts. , the welding surfaces of the target and the backplane are oppositely arranged and attached, and then cooled, and the target assembly is formed after the solder solidifies. [...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/00B23K3/08B23K1/00B23K1/08
CPCB23K1/0008B23K1/08B23K3/00B23K3/08B23K3/085
Inventor 姚力军边逸军潘杰王学泽翁前军张国洪
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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