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Object thickness measuring method, device and system based on ultrasonic waves, equipment and medium

An ultrasonic and thickness measurement technology, which is applied in the field of ultrasonic-based object thickness measurement, can solve the problems of different degrees of measured objects, small test values, damage, etc.

Pending Publication Date: 2021-03-02
广州市东儒电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the existing technology, in order to accurately test the thickness of an object with a covering, the covering has to be removed, and the real thickness of the object can only be measured after being polished. The method will cause different degrees of damage to the object under test, and the grinding must be very careful, otherwise the test value will be much smaller than the actual value, so non-destructive testing cannot be done

Method used

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  • Object thickness measuring method, device and system based on ultrasonic waves, equipment and medium
  • Object thickness measuring method, device and system based on ultrasonic waves, equipment and medium
  • Object thickness measuring method, device and system based on ultrasonic waves, equipment and medium

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Embodiment 1

[0064] At present, most of the thickness measurement principles of ultrasonic thickness gauges on the market are to record the time from when the ultrasonic wave is emitted to when it is received, and then calculate the thickness according to the formula: , is the thickness of the material to be tested; is the propagation speed of ultrasonic waves in the tested material; is the propagation time of ultrasonic waves in the tested material.

[0065] like figure 1 and figure 2 , according to the currently used test method, detect the moment when the waveform returns for the first time, record the measurement time, and then calculate the thickness of the measured object according to the thickness calculation formula. This method can measure the measured object without covering, but this The disadvantage of this method is that it cannot effectively remove the influence of the covering, and when the thickness of the covering cannot be ignored, the measurement result of the ...

Embodiment 3

[0122] In one embodiment, an object thickness measurement device based on ultrasound is provided, and the object thickness measurement device based on ultrasound corresponds to the object thickness measurement method based on ultrasound in the above embodiments. like Figure 13 As shown, the ultrasonic-based object thickness measuring device includes an echo time acquisition module 10 and a thickness calculation module 20 . The detailed description of each functional module is as follows:

[0123] The echo time acquiring module 10 is used to acquire the primary echo time and the secondary echo time after the ultrasonic wave propagates in the target measured object, the target measured object is the measured object covered with the target measured material or the target measured object The test material is not covered with the test object;

[0124] The thickness calculation module 20 is configured to determine the thickness of the target material to be tested according to the...

Embodiment 4

[0145] In one embodiment, a computer device is provided, which is the computer device in the ultrasonic-based object thickness measurement system of this embodiment. When the computer program is executed by a processor, an ultrasonic-based object thickness measurement system is implemented. Thick method, the specific implementation steps are as follows:

[0146] S10: Obtain the primary echo time and secondary echo time after the ultrasonic wave propagates in the target object under test, the target object under test is the object under test covered with the target material under test or the target material under test is not covered with cover of the measured object.

[0147] S20: Determine the thickness of the target material to be tested according to the time difference between the primary echo time and the secondary echo time, and the preset ultrasonic propagation speed in the target material to be tested.

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Abstract

The invention relates to an object thickness measuring method, device and system based on ultrasonic waves, equipment and a medium. The method comprises the following steps: obtaining the primary echotime and secondary echo time of the ultrasonic waves after the ultrasonic waves are transmitted in a target measured object, wherein the target measured object is a measured object of which the target measured material is covered with a covering object or a measured object of which the target measured material is not covered with a covering object; and determining the thickness of the target measured material according to the time difference between the primary echo time and the secondary echo time and the preset propagation speed of the ultrasonic wave in the target measured material. The coating influence can be eliminated, the thickness of an object can be accurately measured, and nondestructive testing is truly achieved.

Description

technical field [0001] The invention relates to the technical field of ultrasonic thickness measurement, in particular to a method, device, system, equipment and medium for measuring thickness of an object based on ultrasonic waves. Background technique [0002] At present, in the field of power industry, ultrasonic thickness gauges are commonly used to detect the thickness of objects, such as for detecting the thickness of boilers, boiler drums and pipes, and for checking the structural dimensions of workpieces. Ultrasonic thickness gauges measure the ultrasonic from The interval time from being transmitted to being received can be converted into the thickness of the measured material. [0003] The above ultrasonic measurement method can meet most of the thickness measurement needs, but there is another usage scenario: a considerable part of the measured object has a covering, such as a painted stainless steel plate, when the paint thickness reaches a certain level, such as...

Claims

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Application Information

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IPC IPC(8): G01S15/08G01S7/536
CPCG01S15/08G01S7/536
Inventor 吴东儒
Owner 广州市东儒电子科技有限公司
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