Guide rail type degumming machine

Abstract

The invention relates to a guide rail type degumming machine, which comprises wafer box units (102) and a degumming unit (103) which are installed on one side of a machine table (101), wherein the twowafer box units (102) are located on the two sides of the degumming unit (103) respectively, a sliding module (105) is slidably arranged on a sliding rail (104) on the other side of the machine table(101), and an adsorption mechanism (106) is installed on the sliding module (105); and each wafer box unit (102) comprises a lifting platform plate (2.1) installed on the lifting module (2.2), and box bodies (2.3) are stacked on the lifting platform plates (2.1). The guide rail type degumming machine is compact in structure, reasonable in design and small in size.

Description

technical field [0001] The invention relates to a rail-type deglue machine, in particular to a device for degumming and cleaning semiconductor substrates (such as wafers), and belongs to the technical field of semiconductor equipment. Background technique [0002] At present, in the manufacturing process of semiconductor devices, the requirements for the cleanliness of semiconductor substrates such as wafer surfaces are becoming more and more stringent. Contaminants such as particles, organic substances and metals on semiconductor substrates usually need to be overcome by chemical reactions or physical forces. The attraction or physical adhesion of chemical bonds is thereby removed. Today, semiconductor substrate cleaning is still dominated by wet cleaning, which is usually divided into two methods: tank cleaning and single-chip cleaning. Tank cleaning can process several substrates at the same time, and has high cleaning efficiency. However, the biggest disadvantage of tan...

AI Technical Summary

Problems solved by technology

Compared with tank cleaning, single-chip cleaning has the advantages of good cleaning effect, high cleaning liquid recovery rate, and effective prevention of cross-contamination, but the production capacity is relatively low compared with tank cleaning

[0003] Therefore, in some processes, in order to obtain a better cleaning effect and appropriately increase the production capacity, it is necessary to use a combination of tank cleaning and single-wafer cleaning to clean the substrate, while the existing tank cleaning devices and single-wafer cleaning devices It is two sets of devices that are completely independent and separated. After the substrate is cleaned in the tank cleaning device, it is then cleaned and dried in the single chip cleaning device, resulting in a long cleaning process cycle, high cleaning costs, and the two sets of devices occupy a large space

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