Mechanism capable of reducing shaking in Tape Bonding technological process

Abstract

The invention discloses a mechanism capable of reducing shaking in a Tape Bonding technological process. The mechanism is characterized in that all cooling air inlet holes are inclined downwards by 15degrees, so that the influence of cooling air on a chip can be avoided, the shaking of the chip is reduced, a telescopic rod can be driven to slide in a sliding sleeve by rotating and unfolding a rotating plate, the bumping of a buffer barrier film can be avoided, meanwhile, the buffer barrier film can be stretched by rotating and unfolding the rotating plate, so that an oblique opening is opened, and through the open oblique opening, and the cold air can cool down the outer wall on the upper side of a support column. Therefore, the surface of the support column is cooled, the impact force ofcold air on the bottom surface of the chip is reduced, the chip jitter is reduced, the pin bonding precision is improved, and the impact force of the cold air can be reduced due to the buffer barrierfilm with buffer barrier property, so that the cold air is softer, the bottom surface of the chip can be cooled, and thermal expansion of the chip is prevented.

Description

technical field [0001] The invention belongs to the related technical field of COF packaging, and in particular relates to a mechanism capable of reducing jitter during a Tape Bonding process. Background technique [0002] Tape-and-roll film on-chip packaging (chiponfilm, referred to as cof)), flip-chip packaging technology uses a flexible circuit substrate as the carrier of the packaged chip, that is, the flexible circuit substrate is used as the above-mentioned circuit substrate, and then the chip is placed on the chip by thermal compression technology. The bumps are bonded to the inner pins of the flexible circuit substrate. [0003] The existing COF packaging technology has the following problems: In the existing COF packaging field, in the inner pin bonding process, a supporting base is required during the bonding process of the integrated circuit device and the chip. In this process, the chip is greatly affected by temperature. The gap between the normal chip pins is ...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a mechanism that can reduce the jitter during the Tape Bonding process, so as to solve the problem that the exhaust hole proposed in the above-mentioned background technology will cause a large jitter of the adsorbed chip and affect the accuracy of the bonding.

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