Preparation method of three-dimensional skeleton of heat-conducting filler, three-dimensional skeleton and polymer composite material

A technology of thermally conductive filler and three-dimensional skeleton, which is applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of thermal conductivity anisotropy, complex process, etc., and achieve the effects of enhanced heat transfer, simple operation, and improved thermal conductivity

Inactive Publication Date: 2021-03-05
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems of complex process and anisotropy of thermal conductivity in the prior art, the present invention provid...

Method used

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  • Preparation method of three-dimensional skeleton of heat-conducting filler, three-dimensional skeleton and polymer composite material
  • Preparation method of three-dimensional skeleton of heat-conducting filler, three-dimensional skeleton and polymer composite material
  • Preparation method of three-dimensional skeleton of heat-conducting filler, three-dimensional skeleton and polymer composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] 500ml concentration is 2mg / ml graphene oxide water dispersion liquid and 50g hexagonal boron nitride flakes are stirred in the beaker or ultrasonically mix uniformly, then add 1 gram of ascorbic acid, 2 grams of alkyl glycoside water dispersion liquid (50%wt) with stirring Continue stirring at low paddle speed (below 600 rpm) until homogeneous. Increase the rotation speed to 1500 rpm, stir and foam for about 5 minutes, pour the foaming solution obtained at this time into a container, seal it, and place it in a blast oven at 65°C for 6 hours for reduction. The foamed hydrogel taken out was further dried in a blast oven at 60°C. The dried gel was further heat-treated in a blast oven at 200° C. for 5 hours. Submerge the obtained gel in the liquid silicone rubber that has been evenly mixed with the curing agent, put it in a vacuum oven at room temperature to vacuum and degas for 2 hours, take out the airgel impregnated with the silicone rubber, and vulcanize it at 100°C A...

Embodiment 2

[0049] Stir or ultrasonically mix 50ml of graphene oxide aqueous dispersion with a concentration of 20mg / ml and 5g of graphene nanosheets in a beaker, then add 2g of ethylenediamine and 2.5g of sodium dodecylsulfonate with a stirring paddle at low speed (below 600 rpm) and continue to stir until even. Increase the rotation speed to 1500 rpm, stir and foam for about 5 minutes, pour the foaming solution obtained at this time into a container, seal it, and place it in a blast oven at 90°C for 15 minutes for reduction. The foamed hydrogel taken out was further dried in a blast oven at 60°C. The dried gel was further heat-treated in a blast oven at 2000°C for 1 min. Immerse the obtained gel in the liquid epoxy resin monomer that has been evenly mixed with the curing agent, put it in a vacuum oven at room temperature and degas it for 2 hours, take out the airgel impregnated with epoxy resin, and put it on the After curing for 1 hour at 100° C., a composite material containing 17.6...

Embodiment 3

[0051] 100ml concentration is that 10mg / ml graphene oxide aqueous dispersion and 30g aluminum oxide are stirred in the beaker or ultrasonically mixed, then add 3 grams of pyrrole, 1 gram of alkylphenol polyoxyethylene ether with stirring paddle at low speed (600 rpm Minutes below) continue to stir until uniform. Increase the rotation speed to 1500 rpm, stir and foam for about 5 minutes, pour the foaming solution obtained at this time into a container, seal it, and place it in a blast oven at 80°C for 2 hours for reduction. The foamed hydrogel taken out was further dried in a blast oven at 60°C. The dried gel was further heat-treated in a blast oven at 1000° C. for 2 hours. Submerge the obtained gel in the liquid polyurethane that has been evenly mixed with the curing agent, put it in a vacuum oven at room temperature to vacuum and degas for 2 hours, take out the airgel impregnated with polyurethane, and vulcanize it at 100°C for 1 hour , that is, a composite material contain...

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Abstract

The invention discloses a preparation method of a three-dimensional skeleton of a heat-conducting filler, a three-dimensional skeleton and a polymer composite material. The preparation method comprises the following steps of: uniformly mixing a graphene oxide aqueous dispersion with the heat-conducting filler, adding a reducing agent and a surfactant, and uniformly stirring the mixture; and then carrying out stirring and foaming, carrying out sealed reduction on foaming liquid to obtain hydrogel, drying the hydrogel, and finally carrying out heat treatment on the dried gel. According to the preparation method, a heat-conducting filler three-dimensional porous network taking reduced graphene oxide as a skeleton is prepared through combining the water-phase surfactant foaming method with graphene oxide gelation; macromolecules are injected into the filler skeleton by virtue of a vacuum-assisted impregnation method, and finally curing is performed to obtain the corresponding high-heat-conductivity polymer composite material. The method disclosed by the invention is simple in process; the obtained composite material is internally provided with the continuous heat conduction network, and the heat conduction of the composite material is isotropic and far superior to that of a traditional randomly dispersed sample.

Description

technical field [0001] The invention relates to the technical field of heat-conducting materials, in particular to a method for preparing a three-dimensional skeleton of a heat-conducting filler, a three-dimensional skeleton and a polymer composite material. Background technique [0002] With the increasingly obvious trend of integration and miniaturization of electronic and optical systems, effective heat dissipation has become a key issue. Generally, system overheating is reduced or prevented by using a thermal interface material (TIM) between the heat source (i.e., the operating device unit) and the heat sink. Therefore, a TIM with high thermal conductivity is very critical to realize reliable and long-lived microelectronic devices. In addition, with the advent of the 5G era, the data transmission volume of electronic devices such as mobile phones has greatly increased, which will continue to increase the risk of overheating of smartphones. Studies have shown that 5G is...

Claims

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Application Information

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IPC IPC(8): C09K5/14C08L83/04C08L63/00C08L75/04C08K7/24C08K3/38C08K3/22C08K3/08C08K3/04
CPCC08K3/04C08K3/08C08K3/22C08K3/38C08K7/24C08K2003/085C08K2003/2227C08K2003/385C08K2201/011C09K5/14C08K3/042C08L83/04C08L63/00C08L75/04
Inventor 卢咏来李京超林驭韬张朝旭咸越赵秀英张立群
Owner BEIJING UNIV OF CHEM TECH
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