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Semiconductor package

A semiconductor and liquid cooling technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of unsatisfactory thermal performance and heat dissipation efficiency, reduce warpage, facilitate installation, The effect of improving mechanical strength

Pending Publication Date: 2021-03-05
MEDIATEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal performance and heat dissipation efficiency of the above construction are still unsatisfactory

Method used

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  • Semiconductor package
  • Semiconductor package
  • Semiconductor package

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Embodiment Construction

[0029] In the detailed description of embodiments of the invention, the drawings are shown in the drawings, and the specific preferred embodiments of the present invention can be practiced by illustrated in the drawings. .

[0030] These embodiments have been described in detail to enable those skilled in the art to practice them, and it should be understood that other embodiments may be utilized, and mechanical, chemical, and can be made without departing from the spirit and scope of the invention. Electrical and program changes. The scope of the invention. Thus, the following detailed description should not be construed as limiting, and the scope of the embodiments of the invention is limited only by the appended claims.

[0031] It will be understood that when the element or layer is called another element or layer "", "" connection to "or" coupled to "other element or layer, it can be directly above the other element or the layer. Connect or coupled to another element or layer...

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Abstract

The invention provides a semiconductor package including a substrate, a die mounted on a top surface of the substrate in a flip-chip fashion, and a lid mounted on the die and on a perimeter of the substrate. The lid includes a cover plate and four walls formed integral with the cover plate. A liquid-cooling channel is situated between the cover plate of the lid and a rear surface of the die for circulating a coolant relative to the semiconductor package. In this way, dies can be cooled through liquid cooling, and therefore the performance stability and reliability of semiconductor packaging are determined. Moreover, the lid can improve the mechanical strength of the semiconductor package and reduce warping, so that the semiconductor package is convenient to install.

Description

Technical field [0001] The present invention relates to the field of semiconductor technology, and more particularly to a semiconductor package. Background technique [0002] Managing the heat generated by the semiconductor chip in the work has become an important technical issue. As the temperature rises, the chip failure rate will increase, and the heat may cause permanent damage to the semiconductor chip. Therefore, effective heat dissipation is a key problem of semiconductor packaging. [0003] Conventionally, the heat sink is attached to the surface of the semiconductor package to improve heat dissipation. For example, in the case of a semiconductor package having a resin molded material having a packaging semiconductor chip, the heat sink is directly attached to the surface of the mold. The heat is passed to the heat sink by molding, and the heat sink is heat-dissipated. However, the mold has a relatively low thermal conductivity, and the heat dissipation efficiency of the ...

Claims

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Application Information

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IPC IPC(8): H01L23/473H01L23/31
CPCH01L23/3128H01L23/473H01L23/16H01L23/562H01L24/16H01L2224/16227H01L2924/3511
Inventor 许家豪陈泰宇郭圣良杨柏俊
Owner MEDIATEK INC