Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electromagnetic interference shielding structure, flexible circuit board and manufacturing method thereof

A technology of electromagnetic interference shielding and flexible circuit boards, applied in flexible printed circuit boards, printed circuit manufacturing, reduction of crosstalk/noise/electromagnetic interference (etc.), can solve problems such as thick thickness, and achieve the effect of low material cost

Pending Publication Date: 2021-03-05
UNIFLEX TECH
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the thickness of the electronic product with the aforementioned multilayer printed circuit board is relatively thick

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electromagnetic interference shielding structure, flexible circuit board and manufacturing method thereof
  • Electromagnetic interference shielding structure, flexible circuit board and manufacturing method thereof
  • Electromagnetic interference shielding structure, flexible circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0043] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the embodiments with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the directions of the drawings. Accordingly, the directional terms used are illustrative, not limiting, of the invention. Also, in the following embodiments, the same or similar components will be given the same or similar symbols.

[0044] Figure 1A to Figure 1E is a partial cross-sectional schematic diagram of a partial manufacturing method of a flexible circuit board 100 with an electromagnetic interference shielding structure according to the first embodiment of the present invention.

[0045] Please refer to Figure 1A , providing a flexible circuit board body 110 . The flexible circuit board bo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a flexible circuit board with an electromagnetic interference shielding structure. The flexible circuit board comprises a flexible circuit board body and the electromagneticinterference shielding structure. The electromagnetic interference shielding structure comprises a bonding layer, an insulating layer and a metal shielding layer. Two opposite sides of the insulatinglayerare in direct contact with the bonding layer and the metal shielding layer. The electromagnetic interference shielding structure is configured on the flexible circuit board body. The bonding layer ofthe electromagnetic interference shielding structure is in direct contact with the flexible circuit board body. An electromagnetic interference shielding structure is also provided. The flexible circuit board with the electromagnetic interference shielding structure is also provided.

Description

technical field [0001] The invention relates to an electromagnetic interference shielding structure, an electronic component and a manufacturing method thereof, in particular to an electromagnetic interference shielding structure applied to a flexible printed circuit board, a flexible circuit board with an electromagnetic interference shielding structure and a manufacturing method thereof. Background technique [0002] With the development of high-frequency signal transmission, multi-layer printed circuit boards (multi-layered PCB, which can be referred to as: multi-layer boards) are used in many electronic products, and the inner layer (that is, not located at the top or bottom layer) ) lines are used for high-frequency signal transmission. [0003] Multilayer printed circuit boards often have bonding sheets. Adhesive sheets are mostly made of glass fiber or other fibers impregnated with resin through partial polymerization. Therefore, the thickness of the electronic prod...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11H05K3/00H05K3/40
CPCH05K1/0216H05K1/115H05K1/118H05K3/00H05K3/4038H05K2201/05H05K2201/0715H05K2201/09509
Inventor 黄秋佩洪培豪贾孟寰陈颖星刘逸群李远智
Owner UNIFLEX TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com