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High-temperature non-coupling dual-power inductor and manufacturing method thereof

A non-coupling, dual-power technology, applied in the direction of inductance/transformer/magnet manufacturing, transformer/inductor casing, transformer/inductor coil/winding/connection, etc., can solve problems such as difficult to ensure normal use, and achieve improved shock resistance The effects of dynamic performance, high circuit adaptability, and clear device assembly form

Pending Publication Date: 2021-03-12
TRIO TECH SUZHOU
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the particularity of the inductance device, changing the orientation of the pins also means changing the orientation of the conductors such as its internal coils, which will change the direction of the magnetic field generated by the power inductor during subsequent operation, making it difficult to ensure the high In the application scenario of integration and extremely tight arrangement of components, it will not affect the normal use of other components inside the device

Method used

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  • High-temperature non-coupling dual-power inductor and manufacturing method thereof
  • High-temperature non-coupling dual-power inductor and manufacturing method thereof
  • High-temperature non-coupling dual-power inductor and manufacturing method thereof

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Embodiment Construction

[0031] The present invention proposes a high-temperature uncoupled dual-power inductor and a corresponding manufacturing method suitable for high-precision application scenarios such as servers and cloud server components, and the specific scheme is as follows.

[0032] Such as Figure 1~Figure 3As shown, a high-temperature uncoupled dual-power inductor is composed of an inductor magnet and two inductor conductors 3. The inductor magnet includes a molded inductor body 1 and a molded inductor cover plate 2. The molded inductor body 1 and Both of the formed inductance cover plates 2 are integrally formed and fixed together, the formed inductance main body 1 is provided with two conductor fixing grooves 11 for setting the inductance conductor 3, and the two The inductance conductors 3 are respectively embedded in the two conductor fixing grooves 11, and the connecting pins on the two inductance conductors 3 are bent and attached to the circumferential side of the inductance magne...

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Abstract

The invention discloses a high-temperature non-coupling dual-power inductor and a manufacturing method thereof. The inductor is formed by combining an inductance magnet and two inductance conductors,two conductor fixing grooves are formed in the inductance magnet, the two inductance conductors are embedded in the two conductor fixing grooves respectively; and connecting pins on the two inductanceconductors are bent and attached to the circumferential side face of the inductance magnet. Two grounding devices are further fixedly arranged in the peripheral side of the inductance magnet, and grounding pins on the two grounding devices are bent and attached to the lower end face of the inductive magnet. According to the high-temperature non-coupling dual-power inductor, the size and occupiedspace of a finished product are reduced, the inductor is suitable for various circuit structures, the flexibility of an inductor device in the setting and using process is high, and application scenesare rich.

Description

technical field [0001] The invention relates to a high-temperature inductance device, in particular to a high-temperature non-coupling dual-power inductance and a corresponding manufacturing method thereof, belonging to the technical field of inductance processing. Background technique [0002] Inductor is the most common component in electronic equipment, and it is also one of the important components in the circuit. It is widely used in various circuits and can achieve the functions of filtering, energy storage, matching and resonance. [0003] With the continuous development of technologies such as the Internet and the Internet of Things in recent years, the update iterations of various hardware devices have become increasingly frequent, and the data processing capabilities have increased day by day. Towards the trend of integration and miniaturization. Since this type of hardware device has high requirements for stability during operation, the requirements for its exter...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F27/02H01F27/28H01F27/34H01F41/00
CPCH01F27/02H01F27/28H01F27/34H01F41/00
Inventor 饶金火林伙利
Owner TRIO TECH SUZHOU
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