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A printed circuit board with embedded phase change heat dissipation device

A technology for printed circuit boards and heat sinks, which is applied in the direction of printed circuits, printed circuits connected with non-printed electrical components, printed circuit components, etc. Joule heat and other problems, to achieve the effect of maintaining stable temperature, saving space, and stabilizing heat dissipation

Active Publication Date: 2022-07-05
鹤山市世拓电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the existing PCB heat dissipation scheme cannot realize the problem of high Joule heat generated by the instantaneous high current of the power device, which leads to the instantaneous temperature rise of the PCB board and causes failure.

Method used

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  • A printed circuit board with embedded phase change heat dissipation device
  • A printed circuit board with embedded phase change heat dissipation device
  • A printed circuit board with embedded phase change heat dissipation device

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Embodiment Construction

[0023] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the related content, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only the parts related to the present invention are shown in the drawings.

[0024] It should be noted that the embodiments of the present invention and the features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

[0025] see attached figure 1 , the present invention provides a schematic diagram of a first embodiment of a printed circuit board embedded with a temperature equalizing plate 5, including a first substrate 21, a second substrate 22, and a first ci...

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PUM

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Abstract

The invention provides a printed circuit board embedded with a phase change heat dissipation device, comprising a first base material, a second base material, a first circuit on the top of the first base material, a pad connected with the first circuit, A phase-change heat dissipation device and a heat-conducting part; the pads are used for soldering power devices, and a first base material under the pads is provided with a mounting hole for mounting the phase-change heat-dissipation device, and the phase-change heat-dissipation device is installed In the mounting hole; the second base material is provided with a plurality of through holes, the through holes are provided with a heat conduction part, and the heat of the phase change heat dissipation device is suitable for transferring to the bottom of the second base material along the heat conduction part. The solution of the present invention can guide the heat quickly when the high Joule heat is generated by the instantaneous high current of the power device, and utilize the printed circuit board as a whole to assist heat dissipation, so that the temperature of the power device remains stable.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a printed circuit board embedded with phase-change heat dissipation components. Background technique [0002] As electronic systems become smaller, more functional, and more efficient, in order to meet the continuous improvement of the electrical performance of electronic products, PCBs carry more and more passive and active electronic components. Large-scale integration of components brings high power consumption, resulting in increased power density of electronic systems. If the heat cannot be dissipated smoothly, the junction temperature of the components will rise sharply, which will seriously affect the reliability of electronic equipment. [0003] On the other hand, when the power of the power device gradually increases, the Joule heating on the power transmission line on the circuit board becomes very significant due to the increase of the current. In particular, hi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/18
CPCH05K1/0203H05K1/181H05K1/0204H05K1/0206H05K1/0298Y02E60/14
Inventor 陈博谦任远陈锦标许毅钦刘宁炀
Owner 鹤山市世拓电子科技有限公司