A printed circuit board with embedded phase change heat dissipation device
A technology for printed circuit boards and heat sinks, which is applied in the direction of printed circuits, printed circuits connected with non-printed electrical components, printed circuit components, etc. Joule heat and other problems, to achieve the effect of maintaining stable temperature, saving space, and stabilizing heat dissipation
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0023] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the related content, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only the parts related to the present invention are shown in the drawings.
[0024] It should be noted that the embodiments of the present invention and the features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
[0025] see attached figure 1 , the present invention provides a schematic diagram of a first embodiment of a printed circuit board embedded with a temperature equalizing plate 5, including a first substrate 21, a second substrate 22, and a first ci...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


