A kind of led device, the manufacturing method of led device and led car light

Abstract

The invention discloses an LED device, a manufacturing method of the LED device and an LED vehicle lamp, wherein the LED device includes a substrate, the substrate has a mounting side, at least one group of chips is arranged on the mounting side, and a white ring is arranged around each chip group. A glue layer, a phosphor layer is provided on the side of the chipset far away from the substrate, the white glue layer has a first side far away from the substrate, the phosphor layer has a second side far away from the chipset, the height of the first side is lower than the height of the second side, At least one first groove is recessed on the first side. By setting the first side lower than the second side, the boundary between the white glue layer and the fluorescent layer can be made clear, avoiding the generation of dark areas of light emission, making the light emission color of the LED device more uniform, and shortening the number of chips and chips in the chipset. The heat radiation path of the outside air improves its heat dissipation performance; by setting the first groove, the surface area of ​​the first side can be increased, thereby increasing the surface area of ​​the white glue layer for heat radiation to the outside, and further improving the heat dissipation performance of the LED device .

Description

technical field [0001] The present invention relates to the field of LED technology, and in particular, to an LED device, a manufacturing method of the LED device, and an LED vehicle lamp including the LED device. Background technique [0002] At present, there are two packaging processes for LED devices. One is to fix the chip on a ceramic substrate, paste a fluorescent film on the chip, and then dot white glue around the chip to complete the packaging; the other is to fix the chip on the ceramic substrate. After that, white glue is dispensed around the chip, and then fluorescent glue is sprayed on the chip and the white glue to complete the packaging. In the above two packaging processes, due to the limitations of the process, the boundary between the fluorescent glue and the white glue is not clear, and the boundary between the two will be uneven or the phosphor powder will be scattered, which will affect the spatial distribution uniformity of the luminous color of the la...

AI Technical Summary

Problems solved by technology

In the above two packaging processes, due to the limitation of the process, the boundary between the fluorescent glue and the white glue is not clear, and the boundary between the two will be uneven or the phosphor powder will be scattered, which will affect the spatial distribution uniformity of the light emitting color of the lamp bead, and even It will produce obvious light-emitting dark areas and reduce the light quality of LED devices

In addition, some high-power LED devices also have heat dissipation problems. Long-term use of LED devices in high-temperature environments will lead to a decrease in their life, which is not conducive to the use and maintenance of equipment.

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