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Preparation method of wafer locking ring

A technology of locking rings and wafers, which is applied in the direction of manufacturing tools, heat treatment equipment, metal processing equipment, etc., can solve problems such as difficult control of flatness, achieve the effects of optimizing microstructure, eliminating looseness in the as-cast state, and satisfying mechanical properties

Active Publication Date: 2021-04-02
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even if the rapid detection of flatness can be realized during the preparation process of the wafer locking ring, it still fails to fundamentally solve the problem that the flatness is not easy to control

Method used

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  • Preparation method of wafer locking ring
  • Preparation method of wafer locking ring
  • Preparation method of wafer locking ring

Examples

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Effect test

preparation example Construction

[0068] Such as image 3 As shown, the preparation method of the wafer locking ring of the present invention comprises the steps:

[0069] (1) Forging and stretching the cylindrical titanium ingot, and then performing the first heat treatment to obtain a titanium forging and stretching piece;

[0070] (2) hot-rolling the titanium forgings described in step (1), and then performing a second heat treatment to obtain a titanium hot-rolled piece;

[0071] (3) hollow out the central part of the titanium hot-rolled piece described in step (2) through rough turning, and then carry out the third heat treatment to obtain the titanium ring;

[0072] (4) Finish turning the titanium ring in step (3) according to the target size to obtain a wafer locking ring.

Embodiment 1

[0074] This embodiment provides a method for preparing a wafer locking ring, the preparation method comprising the following steps:

[0075] (1) Prepare a cylindrical titanium ingot with a purity of 99.9%, a diameter of 180mm, and a length of 120mm, and carry out forging and stretching at 950°C. Each forging and stretching process is first drawn according to the drawing and forging ratio of 1.66, and then Upsetting is carried out according to the upsetting forging ratio of 2.22, water cooling is repeated twice, and then the first heat treatment is carried out at 650°C for 120 minutes, and titanium forgings are obtained after air cooling;

[0076] (1') The titanium forging parts described in step (1) are subjected to re-stretching treatment at 800 ° C. Each re-stretching treatment is first drawn according to the elongation forging ratio of 2, and then according to the upsetting forging ratio Upsetting for 2.22, repeated 2 times, water cooling, and then the fourth heat treatment...

Embodiment 2

[0081] This embodiment provides a method for preparing a wafer locking ring, the preparation method comprising the following steps:

[0082] (1) Prepare a cylindrical titanium ingot with a purity of 99.9%, a diameter of 150mm, and a length of 150mm, and carry out forging and stretching at 900°C. Each forging and stretching process is first drawn according to the drawing and forging ratio of 2, and then Upsetting is carried out according to the upsetting forging ratio of 2.5, water cooling is repeated three times, and then the first heat treatment is carried out at 600°C for 150 minutes, and titanium forgings are obtained after air cooling;

[0083] (1') The titanium forging parts described in step (1) are subjected to re-stretching treatment at 750 ° C. Each re-stretching treatment is first drawn according to the elongation forging ratio of 2, and then according to the upsetting forging ratio Upsetting for 2.5, repeated 3 times, water cooling, and then the fourth heat treatmen...

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Abstract

The invention relates to a preparation method of a wafer locking ring, which comprises the following steps: sequentially carrying out forging stretching treatment, first heat treatment, hot rolling treatment and second heat treatment on a cylindrical titanium ingot to obtain a titanium hot-rolled piece, carrying out rough turning to empty the central part of the titanium hot-rolled piece, carryingout third heat treatment to obtain a titanium ring piece, and finally, carrying out finish turning on the titanium ring piece according to the target size to obtain the wafer locking ring. Accordingto the preparation method, third heat treatment is added between rough turning and finish turning, the problem of large deformation in the process of converting the cylindrical titanium hot-rolled piece into the titanium ring piece is effectively prevented, then the wafer locking ring with the flatness smaller than or equal to 0.1 mm is prepared, and the rate of finished products is greatly increased.

Description

technical field [0001] The invention relates to the technical field of wafer deposition and coating, in particular to a method for preparing a wafer locking ring. Background technique [0002] Physical vapor deposition (Physical Vapor Deposition, PVD) refers to the use of low-voltage, high-current arc discharge technology under vacuum conditions to use gas discharge to evaporate the material source and ionize both the evaporated substance and the gas, and then pass The acceleration of the electric field causes the evaporated substance and its reaction product to deposit on the workpiece to form a thin film with a special function. Physical vapor deposition technology is the core technology of various industries such as semiconductor chip manufacturing, solar energy industry, and LCD manufacturing industry. The main methods include vacuum evaporation, arc plasma plating, ion coating, molecular beam epitaxy, and sputtering coating. Among them, sputtering is the use of ions ge...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/00B21J5/00C21D9/00C21D9/40C22F1/18C23C14/50
CPCB23P15/00B21J5/002C22F1/183C21D9/0075C21D9/40C23C14/50
Inventor 姚力军边逸军潘杰王学泽章丽娜
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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