Etching clamping device for promoting metal etching and separating invalid particles

Abstract

The invention relates to the technical field of computer software and hardware, and discloses an etching clamping device for promoting metal etching and separating invalid particles. The etching clamping device comprises a transmission shaft, the surface of the transmission shaft is fixedly connected with a mounting frame, the interior of the mounting frame is slidably connected with a sliding rod, and the end part of the sliding rod is fixedly connected with a metal contact; and the side face of the metal contact is slidably connected with a resistor strip, an electromagnetic rod is fixedly connected to the interior of the mounting frame, and rotating shafts are fixedly connected to the periphery of the mounting frame. When the mounting frame rotates, the stirring rod performs conical stirring, so that the centrifugal force of an upper-end solution is large, the centrifugal force of a lower-end solution is small, metal ions can be accumulated in the center of the lower end, light impurities can float on the periphery of the upper end of the solution, and when the mounting frame does not rotate, the stirring rod can return to the original shape; therefore, the effects that invalid particles can be separated and the purity of ions participating in the reaction is relatively high are achieved.

Description

technical field [0001] The invention relates to the technical field of computer software and hardware, in particular to an etching clamping device for promoting metal etching and separating invalid particles. Background technique [0002] In the software and hardware of the computer, the main board can provide power supply for various hardware and software, so that the computer equipment can operate normally. In the manufacturing process of the main board, after the circuit layout is designed, it is necessary to etch the copper on the surface of the circuit. However, the current etching device cannot automatically clamp it, and manual clamping is required, and the angle of impurity ions inside the solution affects the etching work of the main board. [0003] In order to solve the above problems, the inventor provides an etching clamping device that promotes metal etching and separates invalid particles. When the mounting frame is rotated, the stirring rod is conically stirre...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies in the prior art, the present invention provides an etching clamping device that promotes metal etching and separates invalid particles, which can be automatically fixed when the main board is placed on the surface of the receiving plate, and can heat the solution around the main board so that The metal ions around the main board are relatively active, the chemical reaction is more efficient, and it can separate invalid particles and make the ions participating in the reaction have a higher purity. This solves the problem that the current etching device cannot automatically clamp it and needs manual clamping. and the angle of impurity ions inside the solution affects the etching work of the motherboard

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