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Method for preparing modular circuit board

A technology for circuit boards and motherboards, which is applied in the direction of circuit devices, printed circuit components, and electrical components to assemble printed circuits. effect of thickness

Active Publication Date: 2022-03-25
株洲菲斯罗克光电科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a modular circuit board and a preparation method thereof, which are used to solve the technical problems that existing stacked circuit boards also have too high thickness and occupy a large space

Method used

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  • Method for preparing modular circuit board
  • Method for preparing modular circuit board
  • Method for preparing modular circuit board

Examples

Experimental program
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Embodiment 1

[0034] Such as Figure 1-Figure 2 As shown, a modular circuit board is disclosed in this implementation, including: a main board 1 and a module board assembly.

[0035] Wherein, the module board assembly includes a shielding cover 3 and a small module board 2, the shielding cover 3 is built into the hollow area 12, the mounting surface of the module small board 2 is covered with the shielding cover 3, and the device 25 on the mounting surface is placed on the shielding cover 3 In the shielded space formed with the module board 2.

[0036] As an alternative solution, the positions of the shielding cover 3 and the small module board 2 can be exchanged, that is, the small module board 2 is built into the hollow area 12 , and the small module board 2 is covered by the shielding cover 3 .

[0037] Among them, such as image 3 As shown, the shielding cover 3 includes a cover body 31 and a plurality of first installation protrusions 32 distributed around the opening of the cover bo...

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PUM

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Abstract

The invention discloses a module circuit board and a preparation method thereof. The module circuit board includes a main board and a module board assembly, the main board is provided with a hollow area, and the module board assembly is embedded in the hollow area of ​​the main board. Compared with the prior art, the present invention embeds the module board components in the hollowed out area of ​​the main board by setting up a hollow area on the main board, which effectively reduces the thickness of the module circuit board while ensuring the stability of the general module and reducing the difficulty of design , and reduce the installation space.

Description

technical field [0001] The invention relates to the technical field of circuit board preparation, in particular to a module circuit board and a preparation method thereof. Background technique [0002] The general-purpose modules on the circuit board are generally designed separately to ensure the stability of the general-purpose modules, greatly improve the overall design efficiency of the system, and reduce the design difficulty. For example, the power module is separately designed as a power board, and the wireless module is separately designed as a wireless small board. [0003] Generally, the general-purpose modules designed separately are generally fixed on the main board of the circuit board, and the general-purpose modules that are very sensitive to interference will also buckle the shield cover, such as the photoelectric conversion module part used in the fiber optic gyroscope, the electrical conversion module of the fiber optic gyroscope, etc. The module part is g...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K3/34
CPCH05K1/0216H05K3/34
Inventor 李慧鹏王已熏易军
Owner 株洲菲斯罗克光电科技股份有限公司