Integrated circuit heat dissipation device

Abstract

The invention discloses an integrated circuit heat dissipation device in the technical field of circuit board testing devices, and the device comprises a worktable top table, a support base is arranged on the worktable top table, a heat dissipation mechanism, a circulating power pump and a pressing mechanism are arranged on the support base, a water tank is arranged behind the support base, and the water tank is arranged on the worktable top table; the heat dissipation mechanism comprises a heat dissipation base, the heat dissipation base is fixedly installed on the support base, a plurality of buffer rigid columns and a lower heat dissipation plate are installed on the heat dissipation base, a heat dissipation circulating plate is fixedly connected to the upper surface of the lower heat dissipation plate, a heat dissipation heat conduction plate is fixedly connected to the upper surface of the heat dissipation circulating plate, and a heat dissipation silica gel plate is fixedly connected to the upper surface of the heat dissipation heat conduction plate. By arranging the heat dissipation mechanism, the sizes of the heat conduction holes of the silica gel plate are slightly smaller than those of heat dissipation heat conduction columns during design and processing, and the heat dissipation silica gel plate and the heat dissipation heat conduction columns are in closer contact after being installed due to certain elasticity of the heat dissipation silica gel plate, so that the heat dissipation efficiency of the device is improved.

Description

technical field [0001] The invention relates to the field of circuit board testing equipment, in particular to an integrated circuit cooling device. Background technique [0002] An integrated circuit is a tiny electronic device or component. Using a certain process, the transistors, resistors, capacitors, inductors and other components required in a circuit are interconnected, and they are fabricated on a small or several small semiconductor wafers or dielectric substrates, and then packaged in a tube. , and become a microstructure with required circuit functions; all the components in it have been structurally integrated, making electronic components a big step towards miniaturization, low power consumption, intelligence and high reliability. Most of today's semiconductor industry uses silicon-based integrated circuits. After oxidation, photolithography, diffusion, epitaxy, aluminum evaporation and other semiconductor manufacturing processes, the semiconductors, resistors...

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Problems solved by technology

[0003] In the prior art, functional testing is required when designing prototypes of integrated circuits. Due to the large number of test types and long time consumption, the integrated circuit board may be damaged or the test parameters are inaccurate during the test process due to poor heat dissipation. At the same time, due to the integrated There are various shapes of circuit boards, and it is time-consuming and labor-intensive to customize matching cooling devices, which has an impact on the development of integrated circuit boards

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