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Encapsulation film

A technology of encapsulation film and encapsulation layer, applied in the fields of photovoltaic power generation, electrical components, climate sustainability, etc., can solve the problems of panel warpage and component deterioration, and achieve the effect of maintaining heat resistance and durability

Pending Publication Date: 2021-04-09
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Organic materials and metal electrodes, etc. contained in OLEDs can be easily oxidized by external factors such as moisture, and if the heat generated when driving OLED panels cannot be released smoothly, deterioration of elements due to temperature rise becomes a problem and operates at high temperatures When panel warping becomes an issue

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0103] Manufacture of encapsulation layer

[0104] A CaO (average particle size less than 5 μm) solution (50% solid content) was prepared as a moisture adsorbent. Separately, a solution (solid content 50%) in which 200 g of butyl rubber resin (BT-20, Sunwoo Chemtech) and 60 g of DCPD petroleum resin (SU5270, Sunwoo Chemtech) were diluted with toluene was prepared, and then the solution was homogenized. Introduce 10 g of multifunctional acrylate (trimethylolpropane triacrylate, Miwon) and 3 g of photoinitiator (Irgacure 819, Ciba) into the homogenized solution to make it homogenized, then introduce 100 g of CaO solution thereinto, and then Stir at high speed for 1 hour to prepare encapsulation layer solution.

[0105] The encapsulation layer solution prepared above was applied to the release surface of the release PET using a comma coater and dried in a drier at 130° C. for 3 minutes to form an encapsulation layer with a thickness of 50 μm.

[0106] Manufacture of encapsu...

Embodiment 2

[0110] An encapsulation film was produced in the same manner as in Example 1 except that the thickness of the aluminum foil (the first layer of the metal layer) was changed to 30 μm.

Embodiment 3

[0112] An encapsulation film was produced in the same manner as in Example 1 except that the thickness of the aluminum foil (the first layer of the metal layer) was changed to 20 μm.

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Abstract

The present application relates to an encapsulation film, an organic electronic device comprising same, and a method for manufacturing the organic electronic device using same, and provides an encapsulation film which enables the formation of a structure capable of blocking moisture or oxygen entering in the organic electronic device from the outside, enables the effective release of heat accumulated inside the organic electronic device, and may prevent the degradation of the organic electronic device.

Description

technical field [0001] Cross References to Related Applications [0002] This application claims the benefit of priority based on Korean Patent Application No. 10-2018-0104550 filed on September 3, 2018, the disclosure of which is incorporated herein by reference in its entirety. [0003] The present invention relates to an encapsulating film, an organic electronic device including the same, and a method of manufacturing an organic electronic device using the same. Background technique [0004] An organic electronic device (OED) means a device including an organic material layer that generates an alternating current of charges using holes and electrons, and examples thereof may include photovoltaic devices, rectifiers, emitters, organic light emitting diodes (OLEDs), and the like. [0005] Organic light emitting diodes (OLEDs) among the above organic electronic devices have less power consumption and faster response speed than existing light sources, and are advantageous...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/44H01L51/00
CPCY02E10/549Y02P70/50H10K50/8445H10K50/844H10K50/87H10K50/846H10K71/40H10K71/10H10K30/88H10K50/8426H10K71/00H10K2102/351
Inventor 文圣男李承民金恩贞睦英凤梁世雨崔峻源
Owner LG CHEM LTD
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