Unlock instant, AI-driven research and patent intelligence for your innovation.

Ultrasonic cleaning device for PCB processing

A technology of PCB board and cleaning device, applied in the field of PCB board processing, can solve the problems of lack of shock absorption function, damage to the local area of ​​the water tank, inconvenient disassembly and replacement, etc., to avoid burns of high-temperature workpieces, improve processing efficiency, and reduce maintenance costs. Effect

Inactive Publication Date: 2021-04-13
九江华秋电路有限公司
View PDF8 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, most of the traditional ultrasonic cleaning devices have the following problems: First, the ultrasonic vibration parts are directly installed on the bottom of the tank, which is inconvenient to disassemble and replace, and after long-term use, it will cause serious damage to the local area of ​​the tank, shortening the use of the ultrasonic cleaning device Second, it does not have the function of shock absorption, and the ultrasonic vibration parts will generate certain noise when working, which affects the working environment of personnel, and the vibration process of the device will cause unnecessary friction damage to the ground, which limits the ultrasonic cleaning device. thirdly, the workpiece after cleaning often has a high temperature due to ultrasonic vibration, and it is inconvenient for personnel to take it directly, which inevitably affects the processing efficiency of the PCB board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ultrasonic cleaning device for PCB processing
  • Ultrasonic cleaning device for PCB processing
  • Ultrasonic cleaning device for PCB processing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] see Figure 1-6, the present invention provides a technical solution: an ultrasonic cleaning device for PCB board processing, including a chassis 1, a lifting guide rail 2, a lifting cylinder 3, a lifting seat 4, a suspension plate 5, an ultrasonic generator 6, a fixing assembly 7, Ultrasonic transducer 8, ultrasonic horn 9, ultrasonic working head 10, shock-absorbing feet 11, water tank 12, mesh basket 13, handle 14, sewage outlet 15 and filter screen ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an ultrasonic cleaning device for PCB processing. The ultrasonic cleaning device for PCB processing comprises a case, a lifting guide rail, a lifting cylinder, a lifting seat, a suspension plate, an ultrasonic generator, a fixing assembly, an ultrasonic transducer, an ultrasonic amplitude-change pole, an ultrasonic working head, damping support legs, a water tank, a mesh basket, a lifting handle, a drain outlet and a filter screen; and one side of the top of the case is fixedly connected with the bottom of the lifting guide rail. According to the ultrasonic cleaning device, the structural design is optimized, and the fixing assembly is additionally arranged, so that personnel can conveniently mount and dismount an ultrasonic vibration part, the maintenance cost of the ultrasonic cleaning device is reduced, the problem that the ultrasonic vibration part damages a local area of the water tank is avoided, and the service life of the ultrasonic cleaning device is prolonged, the damping function is achieved, noise generated when the ultrasonic vibration part works is reduced, the working environment of the personnel is improved, the problem of friction damage to the ground in the device vibration process is avoided, and the application scene of the ultrasonic cleaning device is expanded.

Description

technical field [0001] The invention relates to the technical field of PCB board processing, in particular to an ultrasonic cleaning device for PCB board processing. Background technique [0002] PCB board, the Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. Because it is made using electronic printing, it is called a "printed" circuit board. At present, in the process of PCB board processing, ultrasonic cleaning devices are generally used to clean PCB parts to remove various dirt attached to the surface. [0003] However, most of the traditional ultrasonic cleaning devices have the following problems: First, the ultrasonic vibration parts are directly installed on the bottom of the tank, which is inconvenient to disassemble and replace, and after long-term use, it will cause serious damage to the local are...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/12B08B13/00H05K3/00F16F15/08G10K11/16
CPCB08B3/12B08B13/00F16F15/08G10K11/16H05K3/0085
Inventor 陈遂佰宋林波刘攀
Owner 九江华秋电路有限公司